Semiconductor Packaging Service Market 2020-2025: Increasing demand with Industry Professionals: UTAC, SPIL, ASE, TFME, Unisem, IMEC, eSilicon, Huatian, Chipbond, MegaChips Tech

Global Semiconductor Packaging Service Market Synopsis:

The exclusive research report on the Global Semiconductor Packaging Service Market 2020-2025 examines the market in detail along with focusing on significant market dynamics for the key players operating in the market. Global Semiconductor Packaging Service Industry research report offers granulated yet in-depth analysis of revenue share, market segments, revenue estimates and various regions across the globe.

Major key factors driving the growth of the Global Semiconductor Packaging Service Market are rapid growth in the demand for mobility and connectivity in consumer electronic products. Additionally, increasing demand for digital content has supported growth of home electronic products such as Wi-Fi chipsets and other semiconductor chips. For instance, in 2014, Semiconductor Packaging Service chipPAC (JCET) launched encapsulated Wafer Level Chip Scale Package (eWLCSP) that provides augmented quality and a lower cost fan-in wafer level package for space constrained mobile devices.

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Significant points in table of contents: Market Definition, Market Overview, Business Introduction, Segmentation (Region Level), Segmentation (Type Level), Segmentation (Industry Level), Segmentation (Channel Level), Market Forecast Year, Segmentation Type, Segmentation Industry, Market Cost Analysis, and Conclusion. The Semiconductor Packaging Service Market is segmented based on Product, source, application and Regions. On the basis of product, the market is sub-segmented.

Regionally, North America and Europe holds major share in Global Semiconductor Packaging Service Market. Moreover, Asia-Pacific is expected to record higher growth rate in Semiconductor Packaging Service market during the forecast year.

Top Major Key Players in the Global Semiconductor Packaging Service Market:

1 SPIL

2 ASE

3 TFME

4 Nepes

5 Unisem

6 UTAC

7 eSilicon

8 Huatian

9 Formosa

10 Carsem

11 Amkor Technology

12 Powertech Technology

13 Integra Technologies

14 Walton Advanced Engineering

15 Siliconware Precision Industries and More..................

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Product Type Segmentation

1 Wafer Level Packages

2 System in Package (SiP)

Industry Segmentation

1 Commercial Use

2 Military Use

Worldwide Industry News:

UTAC (April 04, 2019) - UTAC announces license for iBGA packaging technology - UTAC Holdings Ltd., a global semiconductor test and assembly services provider is pleased to announce that it has, via its subsidiary UTAC Headquarters Pte. Ltd. secured a license for relevant patents relating to imaging ball grid array (iBGA) packaging technology from a patent licensing company. Under the patent license, UTAC and its affiliates have full rights to manufacture, use and sell products utilising iBGA packaging technology that is claimed in the licensed patents.

The licensed technology will be primarily used for the assembly of image sensor packages for automotive and industrial camera applications, as well as other sectors such as security, computing and consumer. Both primary market sectors are growing rapidly, particularly as more automakers include multiple imaging cameras in their vehicles to support advanced driver assistance systems (ADAS). The use of these cameras is expected to grow rapidly and significantly as vehicles ultimately become fully autonomous. The industrial market sector is also showing strong growth as a result of rapidly growing applications such as machine vision.

UTAC is already experienced in high volume image sensor assembly and test, especially for Tier One customers in the industrial, consumer and automotive marketplaces. These customers demand very high quality, something that UTAC ensures through their Class 10 cleanroom environment that is dedicated to the assembly of front-end wafers into packages (including the new iBGA) and subsequent testing.

The new iBGA packaging technology is ready for manufacturing and is qualified to relevant automotive standards. Several Tier One automotive device suppliers have already expressed an interest in utilizing this technology.

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Major Points in Table of Contents:

Global Semiconductor Packaging Service Market Report 2020

1 Semiconductor Packaging Service Product Definition

2 Global Semiconductor Packaging Service Market Manufacturer Share and Market Overview

2.1 Global Manufacturer Semiconductor Packaging Service Shipments

2.2 Global Manufacturer Semiconductor Packaging Service Business Revenue

2.3 Global Semiconductor Packaging Service Market Overview

2.4 COVID-19 Impact on Semiconductor Packaging Service Industry

3 Manufacturer Semiconductor Packaging Service Business Introduction

3.1 SPIL Semiconductor Packaging Service Business Introduction

3.2 ASE Semiconductor Packaging Service Business Introduction

3.3 TFME Semiconductor Packaging Service Business Introduction

3.4 TSMC Semiconductor Packaging Service Business Introduction

3.5 Nepes Semiconductor Packaging Service Business Introduction

3.6 Unisem Semiconductor Packaging Service Business Introduction

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