Press release
Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market to Witness Huge Growth by Key Players: Micron, Samsung, SK Hynix, Intel, AMD, Fujitsu, IBM, NVIDIA, Xilinx and Others.
According to Market Study Report, Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market provides a comprehensive analysis of the Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market segments, including their dynamics, size, growth, regulatory requirements, competitive landscape, technological trends and emerging opportunities of global industry.This report also provides market landscape and market share information in the Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market. An exclusive data offered in this report is collected by research and industry experts team.Get Free Sample Report @ https://www.reportsnreports.com/contacts/requestsample.aspx?name=525043
The HMC and HBM market is emerging and is expected to grow further in the coming years. The market for HMC and HBM is likely to be valued at USD 922.7 Million in 2018 and USD 3,842.5 Million by 2023, at a CAGR of 33.02% between 2018 and 2023. This report spread across 134 pages, profiling 10 companies and supported with 72 tables and 43 figures are now available in this research.
Top Key Players Profiled in the Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM)Market:
o Micron (US)
o Samsung (South Korea)
o SK Hynix (South Korea)
o Intel (US)
o AMD (US)
o Fujitsu (Japan
o IBM (US)
o NVIDIA (US)
o Xilinx (US)
o Open-Silicon (US)
"Market for HBM expected to grow at the higher CAGR during the forecast period."
Currently, the major application of HBM is graphics. With improved specifications, HBM has started gaining traction in high-performance computing, cloud computing, and networking; the adoption of the HBM technology in these applications is further expected to increase in the coming years. Moreover, HBM is priced at a lower cost than HMC; this has encouraged companies to integrate HBM in their high-end products.
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"Market for CPU accounted for the largest share in 2017."
The high market share of CPUs is due to their significant adoption in high-performance computing, especially in data centers. HMCs have been developed for this particular application to support advanced and intensive real-time operation.CPU plays a critical role in deterring how content can be handled. More the applications and content utility more processing capability is required in CPU.
"Market for graphics application expected to grow at the highest CAGR during the forecast period."
A majority of the products available in the market with the HBM technology are GPU products. HBM was initially adopted in GPUs specifically for graphics applications. For instance, AMD (US) developed the HBM technology along with SK Hynix (South Korea) to be used in GPUs. Along with GPUs, APUs have also been introduced in the market that are increasingly being used for gaming applications.
"Market in North America accounted for the largest share in 2017."
The high adoption of HMC and HBM memories in North America is largely attributed to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. The demand for HPC in North America is growing owing to the increasing market for AI, machine learning, and cloud computing. In addition, major HPC-based CPU and processor providers, such as Intel, are based in North American countries.
Breakdown of primary participants' profile:
o By Company: Tier 1 = 32%, Tier 2 =51%, and Tier 3 =17%
o By Designation: C-level Executives = 27%, Directors =41%, and Others =32%
o By Region: North America = 40%, Europe = 16%, APAC = 38%, and RoW = 6%
Competitive Landscape of Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM)Market:
1 Overview
2 Ranking Analysis
3 Competitive Scenario
3.1 Product Developments and Launches
3.2 Partnerships, Agreements, and Collaborations
3.3 Acquisitions
3.4 Investments and Expansions
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Research Coverage:
The study segments in the HMC and HBM market report include memory type--HMC and HBM; product type-graphics processing unit, central processing unit, accelerated processing unit, field-programmable gate array, application-specific integrated circuit. The study also covers applications and geographic forecast of the market size for various segments with regard to four main regions-North America, Europe, APAC, and RoW.
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