Thin Wafer Processing And Dicing Equipment Market 2020 Analysis by Global Manufacturers - SUZHOU DELPHI LASER CO., LTD, SPTS TECHNOLOGIES LIMITED (ORBOTECH), PLASMA-THERM LLC

The Thin Wafer Processing And Dicing Equipment Market report is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The report provides in-depth analysis of parent market trends, macro-economic indicators and governing factors along with market attractiveness as per segments. The report also maps the qualitative impact of various market factors on market segments and geographies.

The thin wafer processing and dicing equipment market is expected to grow at a CAGR of over 6% during the forecast period (2018 - 2023).

Asia Pacific is the fastest growing semiconductor market in the world. Growing initiatives like Make in India by the Indian government and Vision 2020 by the Chinese government are increasingly drawing attention from the international players to set up local production establishments. In case of India, the recent increment in customs duties on imported electronics is playing a pivotal role attracting companies like Apple to set up local manufacturing plants. According to the SEMI, a prominent global association serving the manufacturing supply chain of the electronics industry, more than 90% of the foundries being constructed in the world during 2017 were situated in the Asia Pacific. It is estimated that most of these foundries are concentrated in China and Japan. With initiatives for Tokyo Olympics 2020 already in motion, semiconductor manufacturing region is expected open up better opportunities for the thinning and dicing equipment shortly.

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The report presents the market competitive landscape and a corresponding detailed analysis of the major vendor/key players in the market. Top Companies in the Global Thin Wafer Processing And Dicing Equipment Market: SUZHOU DELPHI LASER CO., LTD, SPTS TECHNOLOGIES LIMITED (ORBOTECH), PLASMA-THERM LLC, HAN'S LASER TECHNOLOGY CO. LTD, and ASM LASER SEPARATION INTERNATIONAL (ALSI) B.V. and others.

Industry News:

February 2018 - SPTS Technologies received approximately USD 37 million in orders for multiple etch and deposition systems from two GaAs foundry customers. SPTS's Omega plasma etch, Delta PECVD, and Sigma PVD are expected to be installed in these foundries to manufacture radio frequency (RF) devices for 4G and emerging 5G wireless infrastructure.

Market Overview:

The growing adoption of LED lighting in commercial, industrial, and residential sectors is driving the Radio Frequency Identification (RFID) is a major source of demand for wafer processing and dicing equipment. Generally, traditional methods of grinding or thinning are preferred to prepare wafers feasible for RFID applications. This involves grinding wafers as thin as 50 to 120 micrometers. But with most of the RFID technology being integrated into several consumer electronics and identity solutions such as smart cards and identification tags, end-users are increasingly asking for ultra-smooth surfaces and thinner wafers to incorporate them into these devices seamlessly.

This is one of the prime reasons why techniques like chemical mechanical polishing (CMP) are combined with traditional grinding mechanisms increasingly to conform to high-quality plane surface standards of the wafer. This scenario coupled with strong demand for enterprise identity management solutions and automobile telematics applications of the RFID technology is expected to create more demand for thinner wafers driving positive growth for processing and dicing equipment over the forecast period.

Integration of microelectronics into several consumer electronics and smart cards needed for thinner wafers are increasing rapidly. Technologies like RFID, MEMS Devices, and power devices are considered to be the major source of demand for these thin wafers. This scenario is increasingly creating demand for better manufacturing process, especially processing and dicing which are important phases of ultra-thin wafer production. Many new processes such as chemical mechanical polishing (CMP) are increasingly being integrated into the processing phase along with grinding operations to ensure smoothly polished wafer surface. With increasing innovations in enterprise security solutions to manage employees of the organization, upcoming foundries and semiconductor manufacturing establishments and applications in consumer electronics are expected to keep a steady demand for processing and dicing equipment over the forecast period

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Regional Analysis For Thin Wafer Processing And Dicing Equipment Market:

For comprehensive understanding of market dynamics, the global Thin Wafer Processing And Dicing Equipment market is analyzed across key geographies namely:
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Each of these regions is analyzed on basis of market findings across major countries in these regions for a macro-level understanding of the market.

Thin Wafer Processing And Dicing Equipment Market research report delivers a close watch on leading competitors with strategic analysis, micro and macro market trend and scenarios, pricing analysis and a holistic overview of the market situations in the forecast period. It is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis. Further, key players, major collaborations, merger and acquisitions along with trending innovation and business policies are reviewed in the report. The report contains basic, secondary and advanced information pertaining to the Market global status and trend, market size, share, growth, trends analysis, segment and forecasts from 2020-2026.

Following are major Table of Content of Thin Wafer Processing And Dicing Equipment Market:

- Global Market Overview, Drivers, Restraints and Opportunities, Segmentation overview
- Global Market competition by top Players
- Analysis by Regions
- Consumption by Regions
- Consumption, By Types, Revenue and Market share by Types
- Consumption, By Applications, Market share (%) and Growth Rate by Applications
- Complete profiling and analysis of Players
- Industrial Chain, Sourcing Strategy and Downstream Buyers
- Marketing Strategy Analysis, Distributors/Traders
- Global Market Effect Factors Analysis
- Global Market Forecast
- Global Market Research Findings and Conclusion, Appendix, methodology and data source

Finally, all aspects of the Global Market are quantitatively as well qualitatively assessed to study the Global as well as regional market comparatively. This market study presents critical information and factual data about the market providing an overall statistical study of this market on the basis of market drivers, limitations and its future prospects. The report supplies the international economic competition with the assistance of Porter's Five Forces Analysis and SWOT Analysis.

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