Flip Chip Market registering a CAGR of 9%; Powered by High Demand from IoT Devices
The exclusive advantages of flip chip such as less space consumption, better efficiency, more I/O options as well as improved heat dissipation make them apt replacement of wire bond. In addition, improved heat dissipation of ball grid array type flip chips makes them suitable choice in applications, where smaller size is available without the presence of external heat sink. With the collective effect of these factors the flip chip market is anticipated to witness a high growth in next 5-6 years.
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The key players in the flip chip market are focused on expanding their business operations in the emerging countries with new product launches through various research and development facilities. The major players profiled in this report include IBM, Intel Corporation, Fujitsu Ltd., 3M, Samsung electronics Co., Ltd., Amkor Technology, Inc., TSMC, Ltd., Apple, Inc., Texas Instruments, Inc., and AMD, Inc. among others.
2.5D IC packaging technology dominated the overall market owing to its several advantages such as enhanced capacity, improved performance, and reduced system space requirements and low power consumption.
3D IC is expected to register highest CAGR as it is equipped with all the advantages of 2.5D IC as well as some additional advantages.
In bumping technology segment, copper bumping held over 50% due to its exclusive advantages of low cost, compatibility with bond pads and applications in technologies such as transceivers, embedded processors, application processors, power management, baseband, ASICs and SOCs.
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However, Tin-lead eutectic solder is expected to witness low growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.
Electronics industry contributed over 45% of the overall flip chip market in 2019. Imminent need of size reduction in electronics devices, requirement of higher data transmission speed and improvement in efficiency collectively thrust the replacement of wire bond with flip chips in electronics industry, hence making it dominant in the overall market. However, IT and telecommunication would be the fastest growing segment and is expected to register highest CAGR 12.3% during the forecast period.
Asia-pacific dominated the market by accounting over 50% of the total market revenue and it is expected to maintain its dominance throughout the forecast period. This is accredited to the presence of various manufacturing facilities in the region, high consumption and production of electronic products where flip chip is steadily replacing wire bond and ongoing research and development in the region.
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