Press release
Massive Growth of 3D Packaging Market | Key Vendors - lASE, Amkor, Intel, Samsung, AT&S, Toshiba, JCET, Qualcomm
3D Packaging Market
Global 3D Packaging Market Synopsis:
The past four years, 3D Packaging market size to maintain the average annual growth rate from 2014 to 2019, Market analysts believe that in the next few years, 3D Packaging market size will be further expanded, we expect that by 2024, The market size of the 3D Packaging will reach at Higher rank.
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3D Packaging refers to 3D integration schemes that depend on traditional methods of interconnect for example, wire bonding and flip chip to achieve vertical stacks. As of the 2010s, 3D IC packages are widely used for NAND flash memory in mobile devices.
The detailed segments and sub-segment of the 3D Packaging Market are given below:
1) Product Type Segmentation:
3D Wire Bonded
3D Through Silicon Via
3D Package on Package
3D Fan Out Based
2) Industry Segmentation:
Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
Others
3) Region Segmentation:
On the basis of Regional analysis, North America and Europe holds major share in global 3D Packaging market. Moreover, Asia-Pacific is expected to record higher growth rate in 3D Packaging Market during the forecast year.
North America Country (United States, Canada)
South America
Asia Country (China, Japan, India, Korea)
Europe Country (Germany, UK, France, Italy)
Other Country (Middle East, Africa, GCC)
Top Leading player in Global 3D Packaging Market:
lASE, Amkor, Intel, Samsung, AT&S, Toshiba, JCET, Qualcomm, IBM, SK Hynix, UTAC, TSMC, China Wafer Level CSP, Interconnect Systems
Grab your discounted report online with 90 Pages, List of Tables & Figures and in-depth Table of Contents on "Global 3D Packaging Market Report 2020" @ https://www.businessindustryreports.com/check-discount/235107.
Industry news:
Amkor (Jul. 22, 2019)
Amkor Leads 5G mmWave Smartphone, IoT and Emerging Applications with Antenna in Package Technology
Amkor Technology, Inc., a leading provider of outsourced semiconductor assembly and test (OSAT) services, is paving the way for 5G mmWave antenna-in-package (AiP) technology. Amkor's cutting-edge AiP technology has already been deployed into modules designed for smartphones and other mobile devices. Starting in July 2018, Amkor was the first OSAT to market with 5G mmWave AiP technology, expanding on years of advanced System in Package (SiP) experience.
"Amkor has deployed our AiP technology into 5G product applications with a major global communications company, working with them to produce their first AiP product to go to market," said Ron Huemoeller, Corporate VP of R&D for Amkor Technology. "A key focus for us is to continue to develop AiP products with revolutionary packaging concepts that are vital to the implementation of highly integrated circuitry," he added.
The total RF front-end module SiP market is projected to reach US $5.3 billion by 2023, representing an 11.3% compound annual growth rate (CAGR) according to Yole Dveloppement, SA, an industry consulting firm.
"5G will bring more packaging business for OSAT providers," said Santosh Kumar, Yole Korea principal analyst and director, Packaging, Assembly & Substrates. "Typical RF front-end components in smartphones include various switches, filters, amplifiers and the antennas themselves. More and more, SiP technology is needed to implement an increasing number of bands and the development of circuitry in ever-smaller surfaces."
In addition to its formidable SiP capacity and AiP technology, Amkor has developed an extensive toolset to maximize circuit density and address the sophisticated packaging formats required to productize 5G applications - such as double-sided assembly, embedded die in substrate, advanced RDL molding and various types of RF shielding. This toolset, combined with the company's expertise in RF and antenna package design, uniquely positions Amkor to serve customers who want to outsource the challenges and high investment associated with combining multiple ICs with advanced package assembly and test technologies for 5G networks.
As demand for packages that support 5G starts to climb, Amkor is already well underway with the successful implementation of AiP technology.
Grab your report online with 90 Pages, List of Tables & Figures and in-depth Table of Contents on "Global 3D Packaging Market Report 2020" @ https://www.businessindustryreports.com/buy-now/235107/single.
Significant points in table of contents of Global 3D Packaging Market Report 2020:
1 3D Packaging Product Definition
2 Global 3D Packaging Market Manufacturer Share and Market Overview
3 Manufacturers 3D Packaging Business Introduction
4 Global 3D Packaging Market Segmentation (Region Level)
5 Global 3D Packaging Market Segmentation (Product Type Level)
6 Global 3D Packaging Market Segmentation (Industry Level)
7 Global 3D Packaging Market Segmentation (Channel Level)
8 3D Packaging Market Forecasts 2020-2024
9 3D Packaging Segmentation Product Type
10 3D Packaging Segmentation Industry
11 3D Packaging Cost of Production Analysis
12 Conclusions
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