Press release
QY Research: Heat Shrink Terminals and Splices Market to Reach US$ 411.39 million by 2026
Market Research Report
The global Heat Shrink Terminals and Splices market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Heat Shrink Terminals and Splices market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type, and by Application for the period 2015-2026.
By Company
o Molex
o TE Connectivity
o 3M
o Panduit
o ABB (T&B)
o Fuji Terminal
o Shawcor (DSG-Canusa)
o K.S. TERMINALS
o Nichifu
o Hubbell (Burndy)
o NSPA (National Standard Parts Associates)
o Hillsdale Terminal
o FTZ Industries
o Jeesoon Terminals
o UTA Auto Industrial
o Yun Lin Electronic
o Maikasen
o EasyJoint Electric
o AIRIC
o Changhong Plastics Group Imperial Plastics
Segment by Type
o Heat Shrink Ring Terminals
o Heat Shrink Fork Terminals
o Heat Shrink Butt Splices
o Heat Shrink Disconnect Terminals
o Others
Segment by Application
o Automotive Application
o Marine Application
o Industrial Application
o Appliances
o Others
By Region
o North America
o Europe
o China
o Rest of Asia Pacific
o Middle East & Africa
o Latin America
For Sample and Order full Reports @ rahul@qyresearch.com
17890 Castleton Street Suite 218 City of Industry CA 91748 United States
+1 626 428 8800
QY Research is a leading global market research and consulting company. Established in 2007 in Beijing, China, QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and custom research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of service.
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