Press release
China and Taiwan Semiconductor Packaging and Test Equipment Market Insights, Forecast to 2025 - Valuates Reports
The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics. This report mainly studies semiconductor packaging and test equipment market. The scope of statistics is only including following equipment:
1. Prober: Wafer Probe Station
2. Bonder: Die Bonder
3. Dicing Machine
4. Sorter
5. Handler: Test Handler
View full Report: https://reports.valuates.com/sreport/QYRE-Auto-39N99/China_and_Taiwan_Semiconductor_Packaging_and_Test_Equipment_Market_Insights_Forecast_to_2025?utm_source=newsletter&utm_medium=PR&utm_campaign=newswire
The following companies are covered in this report, with sales, revenue, market share for each company:
TEL
DISCO
ASM
Tokyo Seimitsu
Besi
Semes
Cohu, Inc.
Techwing
Kulicke & Soffa Industries
Fasford
Advantest
Hanmi semiconductor
Shinkawa
Shen Zhen Sidea
DIAS Automation
Semiconductor Packaging and Test Equipment market size by countries
China
Taiwan
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Semiconductor Packaging and Test Equipment market size by type:
Wafer Probe Station
Die Bonder
Dicing Machine
Test handler
Sorter
Semiconductor Packaging and Test Equipment market size by Applications:
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
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