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China and Taiwan Semiconductor Packaging and Test Equipment Market Insights, Forecast to 2025 - Valuates Reports

07-02-2019 01:11 PM CET | Industry, Real Estate & Construction

Press release from: Valuates Reports

China and Taiwan Semiconductor Packaging and Test Equipment

China and Taiwan Semiconductor Packaging and Test Equipment market accounted for US$2.40 Bn in 2018 and is expected to grow at a CAGR of 5.41% over the forecast period 2019-2025, to account for US$ 3.48 Bn in 2025.

The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics. This report mainly studies semiconductor packaging and test equipment market. The scope of statistics is only including following equipment:

1. Prober: Wafer Probe Station
2. Bonder: Die Bonder
3. Dicing Machine
4. Sorter
5. Handler: Test Handler

View full Report: https://reports.valuates.com/sreport/QYRE-Auto-39N99/China_and_Taiwan_Semiconductor_Packaging_and_Test_Equipment_Market_Insights_Forecast_to_2025?utm_source=newsletter&utm_medium=PR&utm_campaign=newswire

The following companies are covered in this report, with sales, revenue, market share for each company:

TEL
DISCO
ASM
Tokyo Seimitsu
Besi
Semes
Cohu, Inc.
Techwing
Kulicke & Soffa Industries
Fasford
Advantest
Hanmi semiconductor
Shinkawa
Shen Zhen Sidea
DIAS Automation

Semiconductor Packaging and Test Equipment market size by countries

China
Taiwan

Get a Free Sample Page: https://reports.valuates.com/request/sample/QYRE-Auto-39N99/China_and_Taiwan_Semiconductor_Packaging_and_Test_Equipment_Market_Insights_Forecast_to_2025?utm_source=newsletter&utm_medium=PR&utm_campaign=newswire

Semiconductor Packaging and Test Equipment market size by type:

Wafer Probe Station
Die Bonder
Dicing Machine
Test handler
Sorter

Semiconductor Packaging and Test Equipment market size by Applications:

Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

Inquire for Discount: https://reports.valuates.com/request/discount/QYRE-Auto-39N99/China_and_Taiwan_Semiconductor_Packaging_and_Test_Equipment_Market_Insights_Forecast_to_2025?utm_source=newsletter&utm_medium=PR&utm_campaign=newswire

Contact Us:
Valuates Reports
sales@valuates.com
For U.S. Toll Free Call +1 (425) 388-2538
For IST Call +91-8040957137
Source: Valuates Reports

Website: https://reports.valuates.com/
Blog: https://reports.valuates.com/blogs
LinkedIn: www.linkedin.com/company/valuatesreports/

Valuates is curating premium Market Research Reports from the leading publishers around the globe. We will help you map your information needs to our report repository of Market research reports and guide you through your purchasing decision. We are based out of silicon valley of India (Bengaluru) and provide 24/7 online and offline support to all our customers and just a phone call away.

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