Press release
System in Package (SiP) Technology Market to Hit $30 billion and Reflecting Size Expansion at 9.0% CAGR by 2022 with Industry Key Players - Amkor Technology, Fujitsu, Toshiba, Qualcomm, Renesas Electronics, Samsung Electronics, ChipMOS Technologies, ASE G
The global system in package (SiP) technology market is anticipated to register a CAGR of 9.0% from 2016 to 2022 to attain a market size of around $30 billion by 2022. SiP is a combination of number of integrated circuits enclosed in a single module, which can perform all the functions of electronics systems. In SiP, all the external passive components are integrated into one small chip, which further reduces cost to develop and assemble a printed circuit board (PCB). SiP can be operated in harsh system environments and are less corrosive in nature. In addition, it saves space owing to its compact size and is cost efficient. It is widely adopted in several applications, such as consumer electronics, automotive, and telecommunication.Get PDF sample copy: https://www.premiummarketinsights.com/sample/AMR00012977
Companies Covered in this Report are:
Amkor Technology Inc.
Fujitsu Ltd.
Toshiba Corporation
Qualcomm Incorporated
Renesas Electronics Corporation
Samsung Electronics Co Ltd
Jiangsu Changjiang Electronics Technology Co., Ltd.
ChipMOS Technologies Inc.
Powertech Technologies Inc.
ASE Group
Increase in demand for high performance compact size electronic devices and need for low power consumption devices is expected to drive the market. Moreover, it supports high input impedance and improved parallel current sharing, which fuels the market growth. However, performance issues such as current leakage and breakdown hamper the growth of the market. Irrespective of these challenges, rapid adoption of smartphone & tablets in the emerging countries are expected to provide huge opportunities for growth in the future.
The SiP market is segmented based on packaging technology, packaging type, interconnection technology, application, and geography. The packaging technology segment is divided into 2-D IC packaging, 2.5-D IC packaging, and 3-D IC packaging. The packaging type segment is classified into flat packages, pin grid arrays, surface mount, small outline packages, and others. The interconnection technology is bifurcated into wire bond and flip chip. Based on application, the market is classified into consumer electronics, automotive, telecommunications, industrial system, military, defense & aerospace, and others. Geographically, it is analyzed across North America (U.S., Mexico, and Canada), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET KEY BENEFITS:
Comprehensive analysis of the current trends and future estimations of the global SiP technology market is provided in the report.
The report provides a competitive scenario of the market along with growth trends, structure, driving factors, scope, opportunities, and challenges.
The report includes a detailed analysis of the key segments to provide insights on the market dynamics.
Porter's Five Forces analysis highlights the potential of buyers and suppliers as well as provides insights on the competitive structure of the market to devise effective growth strategies and facilitate better decision-making.
Buy the complete report with Comprehensive table of contents @ https://www.premiummarketinsights.com/buy/AMR00012977
SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET SEGMENTATION:
The global SiP technology market is segmented based on packaging technology, packaging type, interconnection technology, application, and geography.
BY PACKAGING TECHNOLOGY
2-D IC Packaging
2.5-D IC Packaging
3-D IC Packaging
BY PACKAGING TYPE
Flat Packages
Pin Grid Arrays
Surface Mount
Small Outline Packages
Others (Through-Hole Packages, Chip Carrier)
BY INTERCONNECTION TECHNOLOGY
Wire Bond
Flip Chip
BY APPLICATION
Consumer Electronics
Automotive
Telecommunications
Industrial System
Military, Defense & Aerospace
Others (Traction & Medical)
BY GEOGRAPHY
North America
U.S.
Mexico
Canada
Europe
UK
Germany
France
Rest of Europe
Asia-Pacific
India
China
Japan
South Korea
Rest of Asia-Pacific
LAMEA
Latin America
Middle East
Africa
Other players in the value chain include (profiles not included in the report):
GS Nanotech
Siliconware Precision Industries Co., Ltd.
Chipbond Technology Corporation
Octavo Systems LLC
About Premium Market Insights:
Premium Market Insights is a one stop shop of market research reports and solutions to various companies across the globe. We help our clients in their decision support system by helping them choose most relevant and cost effective research reports and solutions from various publishers.
The market research industry has changed in last decade. As corporate focus has shifted to niche markets and emerging countries, a number of publishers have stepped in to fulfil these information needs. We have experienced and trained staff that helps you navigate different options and lets you choose best research solution at most effective cost.
Contact Us:
Name: Sameer Joshi
Organization: Premium Market Insights
Email: sales@premiummarketinsights.com
Phone: +1-646-491-9876
This release was published on openPR.
Permanent link to this press release:
Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.
You can edit or delete your press release System in Package (SiP) Technology Market to Hit $30 billion and Reflecting Size Expansion at 9.0% CAGR by 2022 with Industry Key Players - Amkor Technology, Fujitsu, Toshiba, Qualcomm, Renesas Electronics, Samsung Electronics, ChipMOS Technologies, ASE G here
News-ID: 1761839 • Views: β¦
More Releases from Premium Market Insights
The Future of HVAC: Trends and Innovations
The Europe HVAC System Market HVAC system market was valued at US$ 50,772.07 million in 2022 and is expected to reach US$ 1,25,024.86 million by 2030; it is estimated to grow at a CAGR of 11.9% from 2022 to 2030.
ππ«ππ πππ
ππ¨ ππ§π¨π° ππ¨π«πβ https://www.businessmarketinsights.com/sample/BMIRE00026922?utm_source=OpenPR&utm_medium=10694
Rise in Demand for Energy-Efficient Solutions Fuel the Europe HVAC System Market
Greenhouse gases are the primary sources of global warming and climate change. These gases absorbβ¦
Automated External Defibrillators Market New Business Opportunities and Investme β¦
The Automated External Defibrillators Market is estimated to reach US$ 2,207.94 million in 2030 from US$ 1,556.21 million by 2030; the market is projected to record a CAGR of 4.5% from 2022 to 2030.
Some of the key driving factors for the automated external defibrillators market growth are the increasing prevalence of cardiovascular diseases and rising training and awareness programs on automated external defibrillators. However, performance issues related to automated externalβ¦
Hydrolyzed Collagen Market Types and Applications, Industry Drivers, Future Dema β¦
The Hydrolyzed Collagen Market was valued at US$ 946.43 million in 2022 and is projected to reach US$ 1,322.60 million by 2028; it is expected to register a CAGR of 5.7% from 2022 to 2028.
Various end-use industries are adopting business expansion strategies and scaling production capacity to provide better customer satisfaction. For instance, in July 2020, Rousselot and Giusto Faravelli announced a distribution partnership in Italy, effective from October 2020.β¦
Aroma Ingredients Market Expectations & Growth, Trends Highlighted Until 2028
The Aroma Ingredients Market was valued at US$ 5376.90 million in 2021 and is projected to reach US$ 7692.62 million by 2028; it is expected to grow at a CAGR of 5.2% from 2021 to 2028.
Aroma ingredients are basically isolates of naturally sourced ingredients or chemically produced and are used as ingredients to add aromas or fragrance to various cosmetic and personal care products.
Based on product type, the global aromaβ¦
More Releases for SiP
SIP Scootershop Open Day 2025
The SIP Open Day is traditionally the annual start to the scooter season in Landsberg am Lech! Every May, scooter riders from near and far get on the move, often organized at meeting points in Munich, Augsburg, Ingolstadt etc. and roll to the SIP Scootershop - a big Vespa and Lambretta rally to Upper Bavaria!
Festival of 30 Years Performance & Style
That was the motto of the SIP Open Day 2024,β¦
Sip-Sip Hooray! Celebrates Milestone Year with Over $1 Million in Sales and Expa β¦
The Southern Louisiana-based independent design studio known as Sip-Sip Hooray! has risen to fame since its creation in 2022. In just a short period, the company reached a point where it made over $1 million in sales in 2022. Their astonishing growth was due to their new take on designing drink containers and their well-established online presence, especially on TikTok, which they have used to grow their followers and fansβ¦
Semiconductor IP Market to 2025 - Global Analysis and Forecasts by Type (Process β¦
The global Semiconductor IP market is expected to grow to US$ 8,265.6 million by 2025 from US$ 3,346.1 million in 2017, growing at a CAGR of 11.9%.
The semiconductor IP market is going through tremendous instability thereby plunging the CAPEX spending, due to persistent inventory adjustments in the Chinese smartphone industry. However, a remarkable growth has been witnessed in the automotive industryΓ’β¬β’s semiconductor demand amid the progression of advances in automotiveβ¦
Semiconductor IP Market to 2025 - Global Analysis and Forecasts by Type (CPU SIP β¦
A reusable unit logic or a cell or either a layout design that is developed to license it to multiple vendors for it being used as a building block in eventual designing of a chipset is a semiconductor Intellectual Property (IP). In today's scenario, more and more functionality is being integrated onto a single chipset and therefore the presence of a predesigned IP core block makes the entire chipset designingβ¦
Global Trends in SiP Technology Development
Under the global trends where electronic products are getting thinner, multi-functional and low power, the SiP (System in Package) technology has grabbed increasing attention, especially in recent years where the demand for lightweight mobile devices and wearables rises. With the IoT (Internet of Things) era approaching, multi-functional integration and low power consumption are considered essential when selecting an electronic product. Hence, SiP is playing an increasingly important role in theβ¦
To Achieve Maximum SIP Value, Move Beyond SIP Trunking, Recommends Alsbridge
Award winning benchmarking, sourcing and transformation advisory firm, Alsbridge Inc., today released a report To Achieve Maximum SIP Value, Move Beyond SIP Trunking, discussing why enterprises fail to harness the full value of Session Initiation Protocol (SIP), in spite of it being considered an extremely powerful communications enabler.
Session Initiation Protocol is becoming an increasingly ubiquitous game-changer for businesses. Yet, many enterprises that have already deployed SIP, and many othersβ¦