Redistribution Layer Material Market Anticipated to Expand at a Rapid Pace Till 2027 | Advanced Semiconductor Engineering, Inc. (ASE group), Amkor Technology, Fujifilm Holdings, Hitachi Chemical DuPont MicroSystems L.L.C., Infineon Technologies AG

The global redistribution layer material market accounted to US$ 105.4 Mn in 2018 and is expected to grow at a CAGR of 25.7% during the forecast period 2019 - 2027, to account to US$ 794.5 Mn by 2027.

The global redistribution layer material market by material was led by polyimide segment. The other materials for redistribution layer material market include FEpoxy (phenol & acrylates based), metal and Silicones. A polymer material is required for redistribution layer in the advanced packaging techniques that catalyzes in routing the connection between the solder bumps and the I/O pads. The materials used for redistribution are used as passivation layer for bumping and stress buffers.

Top Key Players:

Advanced Semiconductor Engineering, Inc. (ASE group), Amkor Technology, Inc., Fujifilm Holdings Corporation, Hitachi Chemical DuPont MicroSystems L.L.C., Infineon Technologies AG, Jiangsu Changjiang Electronics Technology Co., Ltd.(JCET), NXP Semiconductors N.V.

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Manufacturing of consumer electronics, healthcare related products, automobiles, and defense industries are some of the prominent industry verticals that have been prolific in the automation integrations into the manufacturing assembly lines. Automation integration requires additional functionalities to be added on the chips for translating the manual operations to automated ones. Increasing the functionalities on chips while maintaining the size of the chip is made possible with the help of redistribution layer material.

GLOBAL REDISTRIBUTION LAYER MATERIAL – MARKET SEGMENTATION

By Material

• Polyimide (PI)
• Polybenzoxazole (PBO)
• Benzocylobutene (BCB)

By Application

• FOWLP
• 2.5D/3D IC Packaging
• By 2.5D/3D IC Packaging
• High Bandwidth Memory (HBM)
• Multi-Chip Integration
• Package on Package (FOPOP)

APAC was the leading geographic market and it is anticipated to be the highest revenue contributor throughout the forecast period. The presence of large semiconductor manufacturing industry in the countries like South Korea, China, Taiwan, and Japan, is expected to fuel growth of redistribution layer material market in this region.

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Strategic Insights

The market players present in redistribution layer material market are mainly focusing towards product enhancements by implementing advance technologies. By signing partnership, contracts, joint ventures, funding, and inaugurating new offices across the world permit the company maintain its brand name globally. Most of the market initiative were observed in Asia Pacific, North America, Europe regions, which have high density of semiconductor manufacturing industries.

Application Insights

The redistribution layer material market by end use is segmented into Fan-Out Wafer Level Packaging (FOWLP) and 2.5D/3D IC Packaging. Advanced packaging techniques integrate multiple die in a single package and thereby ensure in reducing the device footprint. Also, integrating multiple-die in a single package ensures, multiple functionalities of the device in a small form factor.

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