Current Advancement in Molded Interconnect Devices (MID) Market | Trends and Drivers | Key Players are Molex, TE Connectivity, BASF, DSM, Evonik, LANXESS

Molded Interconnect Devices (MID) market is poised to witness an accelerated growth over the ensuing years, amidst the backdrop of the frequent technological advancements in telecommunication sector. The ability of the device to facilitate miniaturization has largely added to the expansion of its application portfolio in a range of consumer products.

The surge in the use of consumer electronic devices including smartphones, tablets, and televisions is anticipated to drive the molded interconnect devices (MID) market growth. These components are increasingly integrated into the smart devices owing to their reduced size and energy-saving features. The antenna integrated components provide enhanced mechanical and electronic enclosure development to the manufacturers.

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In the molded interconnect devices (MID) market, the Laser Direct Structuring (LDS) process segment is anticipated to gain traction over the coming years owing to the ease of processing and low development & tooling costs associated with the manufacturing processes. It consists of a one-step process that integrates plastic creation on the device and enhances the component performance. The MID market is driven by benefits provided by the LDS processes such as the elimination of hazardous chemical pre-treatment and lesser environmental impacts over the legacy processes.

The Major Key Players in the Market are as follows:

1. Galtronics Corporation Ltd.
2. HARTING AG - MID
3. LPKF Laser & Electronics AG
4. Macdermid Enthone
5. Molex
6. Multiple Dimensions AG
7. RTP Company
8. S2P - Smart Plastic Products
9. SelectConnect Technologies
10. Suzhou Cicor Technology Co. Ltd
11. TE Connectivity
12. TEPROSA GmbH
13. Tongda Group Holdings Limited
14. Yomura
15. BASF
16. DSM
17. EMS-CHEMIE (Business Unit EMS-GRIVORY)
18. Ensinger GmbH
19. Evonik
20. LANXESS
21. Mitsubishi Engineering-Plastics corporation
22. PTS Group
23. RTP Company
24. SHENZHEN SINOPLAST ADVANCED MATERIAL CO.,LTD
25. Zeon Corporation

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The healthcare sector in the molded interconnect devices (MID) market is predicted to dominate owing to the growing use of these components in devices such as blood pressure monitors, glucose meters, and oxygen meters that enables improved patient diagnostics. The 3D assemblies of components in medical devices help in enhancing the circuit designs and minimizing the size. These are increasingly being used by dentists and medical pathology labs, thereby driving the MID market growth.

In the Asia Pacific molded interconnect devices (MID) market, countries including China, Japan, and South Korea are expected to witness several growth opportunities owing to the presence of major consumer electronics manufacturers. These components enable ease of processing and low energy consumption thereby benefiting the manufacturing companies. Growth in the disposable income and increased spending capacity of consumers in the Asia Pacific region are further providing an impetus to the MID market growth. Penetration and presence of several raw material suppliers and the growth in the export activities from these countries account for large revenue shares in the Molded Interconnect Devices (MID) Market.

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Besides the consumer electronics and automotive sectors, one of the most anticipated trends in the molded interconnect devices (MID) market remains the contribution of healthcare fraternity to this space. With rapid R&D investments toward healthcare prototyping gaining prominence, the sector is certain to be a profitable end-user for the molded interconnected devices manufacturers. Global Market Insights, Inc. forecasts the healthcare molded interconnect devices (MID) market to record an appreciable double-digit CAGR of 15% over 2018-2024.

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