Global Molded Interconnect Device Market Size to Expand with 13.2% CAGR till 2025 with Major Market Competitors/Players: MacDermind Inc., Molex Llc, LPKF, TE Connectivity, HARTING Technology Group, Johnan America Inc., MID Solutions GmbH

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The Global Molded Interconnect Device Market is expected to reach USD 2119.85 million by 2025, from USD 786.21 million in 2017 growing at a CAGR of 13.2% during the forecast period of 2018 to 2025. The upcoming market report contains data for the historic year 2016, the base year of calculation is 2017 and the forecast period is 2018 to 2025.

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As per survey conducted by Statista, the number of connected installed devices in 2017 was at 20.35 billion while with current trends and increasing adaption the same is forecasted to surpass 75.44 billion by 2025. The total sale in the automotive industry was valued to be 81.5 million units.

Major Players:

Some of the major players operating in the global molded interconnect device market are MacDermind Inc., Molex Llc, LPKF, TE Connectivity, HARTING Technology Group, Arlington Plating Company, Johnan America Inc., MID Solutions GmbH, LaserMicronics, Yomura, TactoTek Corporation, DowDuPont (The Dow Chemical Company, DuPont), Multiple Dimensions AG, Galtronics USA ltd., Teprosa GmbH, Cicor Management AG, 2E Mechatronic, RTP Company, TONGDA Group, and S2P Smart Plastic Products S2P among others.

Major Market Drivers and Restraints:

High trends of wearable devices and its penetration in the market.
Increasing focus on reducing electronic wastes.
Increasing usage of MID in healthcare.
Internet of Things (IoT) and its growing demand among industries.
High costs of raw materials and tooling.
Extent of incompatibility with other electronic systems.

Competitive Analysis:

The global molded interconnect device market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of global molded interconnect device market for global, Europe, North America, Asia Pacific and South America.

Harting has collaborated with Ticona on developing antennas, security applications, commercial sensors etc. Recently DuPont has come up with a palladium doped 2-shot molding in MID.

Table of Contents:

1. Executive Summary

2. Scope/opportunities of the Report

3. Research Methodology

4. Market Landscape

• Market ecosystem
• Market characteristics
• Market segmentation analysis

5. Pipeline Analysis

• Pipeline analysis

6. Market Sizing

• Market definition
• Market sizing
• Market size and forecast

7. Porter’s Five Forces Analysis

• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition

8. Market Segmentation

• Segmentation
• Comparison
• Market opportunity

9. Customer Landscape

10. Regional Landscape

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Market Segmentation:

• The global molded interconnect device market is segmented based on product type, process type, end users, and geographical segments.

• Based on the product, the market is further segmented into antennae and connectivity modules, sensors, connectors and switches, lighting and others.

• Based on process, the market is further segmented into laser direct structuring, two-shot molding, others.

• Based on end users, the market is further segmented into automotive, consumer products, healthcare, industrial, military and aerospace, telecommunication and computing, and others.

• Based on geography the market report covers data points for 28 countries across multiple geographies namely North America & South America, Europe, Asia-Pacific and, Middle East & Africa. Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa and Brazil among others.

Market Definition:

Molded interconnected devices refer to devices interconnected to or molded with circuits to perform functions other than the devices primarily made for. For instance, the calling feature in the steering wheel, the function is made available by interconnecting systems of a headset and subsequent circuits being molded in the steering wheel of the car. With continuous innovation and desire for new technology, the number of patents in molded interconnect devices (MID) has seen a two fold increase since 2010. Back in 20th century MID’s hailed as breakthrough innovation but failed drastically, today with cost optimization and new process along with materials and emergence of new technologies, it is easier for MIDs and manufacturers to penetrate in the market.

Customization of the Report
• All segmentation provided above in this report is represented at country level.
• All products covered in the market, product volume and average selling prices will be included as customizable options which may incur no or minimal additional cost (depends on customization)

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This release was published on openPR.