openPR Logo
Press release

3D Printed Circuits: A Patent Landscape Analysis and Top Vendors are Philips, Northrop Grumman, Global Circuit Innovation

04-17-2019 08:43 AM CET | Business, Economy, Finances, Banking & Insurance

Press release from: IngeniousReports

3D Printed Circuits Patent Landscape, 3D Printed Circuits market, 3D Printed Circuits market research

3D Printed Circuits Patent Landscape, 3D Printed Circuits market, 3D Printed Circuits market research

3D printing is one of the most important technological advancement in additive manufacturing which has been implemented and recognized as a part of the modern industry. 3D printing has many advantages over conventional approach of which one of the most important factors which is time. 3D printing circuits is one of the strongly growing sectors of the 3D printing industry. Many researchers have published widely on the growing market opportunities available in this space. As 3D printing circuits are moving from concept to adoption, some companies are experimenting with this disruptive technology to take electronics to a new dimension.

We looked at the 12-month (April 2018– March 2019) patent filing in the technology space of 3D Printed Circuits. Based on the graphs listed below, it can be observed that patenting activity gained traction in the fused deposition modelling technology. In addition to that, Selective Laser Sintering patents also witnessed a high filing, which corresponded to the numerous applications of Laser Metal Sintering/Melting processes during the study period.

Get Free Sample @

In study period the highest count of patent filled on Fused Deposition Modelling technology followed by Selective Laser Sintering and Stereolithography technology for printing Printed Circuit Boards (PCBs) and other electronic equipment. FDM is preferred over other technologies owing to the durable materials it uses, the stability of their mechanical properties, and the quality of the parts. Copper owing to its high conductivity, durability and affordable cost was used in most of the patents followed by aluminium and gold.

The technology landscape of 3D printed circuits is a mix of mature companies, start-ups and universities with Northrop Grumman Systems as the most active in patent filing followed by Ulsan National Institute of Science and Technology and Phillips.

Table of Content:
1. Introduction
2. Patent Search Strategy
3. Summary
4. Technical Segmentation (Patent Categories)
5. Technology Evolution Trend
6. Technology Insights
7. 3D printed Circuits – Materials vs Technologies
8. 3D printed Circuits product Analysis
9. Recent Technological Innovation
10. Top Players
11. Research activity around world
12. Inventor groups of key companies in 3D printed Circuits
13. Key 3D printed Circuits companies across different technologies
14. Company Profiling
15. Merger & Collaborations
16. Appendix: Search Strings Used for Categorization
17. Sources & References

View Full Report @

IngeniousReports provides one-stop solution platform for all technology, business, and market research dilemmas. We, at IngeniousReports, collaborate with leading global publishers of technology, business and market intelligence reports to industries, individuals and organizations with the endeavor of supporting them in making strategic and cost-effective business decisions.
Phone: +1 347 480 2054

207-208, 2nd Floor, Welldone Tech Park Sohna Road, Sector 48 Gurugram, Haryana

This release was published on openPR.

Permanent link to this press release:

Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.

You can edit or delete your press release 3D Printed Circuits: A Patent Landscape Analysis and Top Vendors are Philips, Northrop Grumman, Global Circuit Innovation here

News-ID: 1706394 • Views: 633

More Releases from IngeniousReports

Technology, Innovation and Market Report: Automotive Blind Spot Detection Soluti …
The global blind spot monitoring systems market is projected to grow at a CAGR of nearly 12.7% in the period between 2019 and 2024. Over the last few years the growth was slow due to the high cost of safety systems and they were primarily installed in premium vehicles. However, in the recent years the growing need for vehicle and passenger safety is making the installation of advanced safety systems
Technology, Innovation and Market Report: Global Green and Bio Polyols | Top Key …
The use of green and bio-polyols has been growing in last years in polyurethane, leather industry, furniture and bedding. Companies are moving towards green chemistry by replacing petrochemical based polyols. This report provides an extensive analysis of technology prospective which is segmented based upon application, functions and type of bio-polyols. This report also comprises of key insights from patent analysis of different companies and universities in this domain. The top
Technology, Innovation and Market Report: Global Flexible Packaging | Key Player …
The flexible packaging is expected to grow rapidly in the upcoming years. As the world is moving towards sustainability, the novel bio-based and biodegradable packaging materials are expected to create a profitable future in the flexible packaging. The report provides in-depth analysis from the technology perspective which is segmented based upon application, material, printing technology and region. Cost-effectiveness and increased shelf life of the products is stroking the demand for flexible
CRISPR/Cas9 Technology Analysis Report | Key Players: Broad Institute, MIT, Harv …
There has been a ceaseless development in gene modification strategy beginning from restriction endonucleases, transgenic breeding, RNAi advances to the currently engineered endonucleases. Over the last few decades, Gene editing took a new turn with the discovery of CRISPR and its variant Cas9. CRISPR not only gave a new image to gene editing but also raised the standards for new findings. CRISPR and CRISPR-associated (Cas) genes market is expected to

All 5 Releases