3D Printed Circuits: A Patent Landscape Analysis and Top Vendors are Philips, Northrop Grumman, Global Circuit Innovation
3D Printed Circuits Patent Landscape, 3D Printed Circuits market, 3D Printed Circuits market research
We looked at the 12-month (April 2018– March 2019) patent filing in the technology space of 3D Printed Circuits. Based on the graphs listed below, it can be observed that patenting activity gained traction in the fused deposition modelling technology. In addition to that, Selective Laser Sintering patents also witnessed a high filing, which corresponded to the numerous applications of Laser Metal Sintering/Melting processes during the study period.
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In study period the highest count of patent filled on Fused Deposition Modelling technology followed by Selective Laser Sintering and Stereolithography technology for printing Printed Circuit Boards (PCBs) and other electronic equipment. FDM is preferred over other technologies owing to the durable materials it uses, the stability of their mechanical properties, and the quality of the parts. Copper owing to its high conductivity, durability and affordable cost was used in most of the patents followed by aluminium and gold.
The technology landscape of 3D printed circuits is a mix of mature companies, start-ups and universities with Northrop Grumman Systems as the most active in patent filing followed by Ulsan National Institute of Science and Technology and Phillips.
Table of Content:
2. Patent Search Strategy
4. Technical Segmentation (Patent Categories)
5. Technology Evolution Trend
6. Technology Insights
7. 3D printed Circuits – Materials vs Technologies
8. 3D printed Circuits product Analysis
9. Recent Technological Innovation
10. Top Players
11. Research activity around world
12. Inventor groups of key companies in 3D printed Circuits
13. Key 3D printed Circuits companies across different technologies
14. Company Profiling
15. Merger & Collaborations
16. Appendix: Search Strings Used for Categorization
17. Sources & References
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