Wafer Level Packaging Technologies Market Analysis Globally, Growth, Explore Business Opportunities and Challenges, Top Key Players (TSMC, Samsung Electro-Mechanics, Amkor Technology, Deca Technologies, STATS ChipPAC, Nepes) 2025 Forecast

Wafer Level Packaging Technologies Market Research Report 2019 aims to deliver an opportunity for companies to recognize the modern trends size, growth, share, segments, manufacturers, and technologies, future road map and 2025 forecast. Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. The report provides a complete analysis of the market which brings out the complete understandings of the industry.

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Market Overview: Wafer level packaging is growing with a notable rate owing to its competitive advantages over other conventional packaging technologies namely wire bonding and flip chip such as compact package footprints, increased functionality, improved thermal performance, and finer pitch interconnection to the printed circuit board. Wafer level packaging (WLP) can be categorized on the basis of integration type and packaging technology used in them.

Furthermore, trending Internet of Things (IoT), technological superiority over traditional packaging techniques, and impending need of circuit miniaturization in microelectronic devices are key factors expected to propel the growth of global WLP market. Thriving demand for small sizes, low costs, and high performance of packaging solutions in electronic devices is going to act as an opportunity for wafer level packaging market.

The following manufacturers are covered: Samsung Electro-Mechanics, TSMC, Amkor Technology, Orbotech, Advanced Semiconductor Engineering, Deca Technologies, STATS ChipPAC, Nepes

Complete report on Global Wafer Level Packaging Technologies 2019 Market Research Report is spread across 93 pages and provides exclusive vital statistics, data, and research analysis lists the key regional countries, highlighting on the extraordinary regions.

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Some of the advantages of wafer level packaging over traditional packaging methods are smaller size, superior performance, and design flexibility. Structural support, clearance for high frequency operation, and mechanical protection are provided by the sealed air cavity that surrounds die. Wafer level packaging offers reduced power consumption, minimal parasitic and extended battery life. Wafer level packaging is thinner than traditional packaging methods, with filters of around 0.13 millimeter. It is one of the major factors considered while designing thinner mobile devices.

Market segment by Type, the product can be split into
Fan-In Wafer-Level Packaging
Fan-Out Wafer-Level Packaging

Market segment by Application, the market can be split into
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Others

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With tables and figures helping analyze worldwide Global Wafer Level Packaging Technologies market, this research provides key statistics on the state of the industry and is a valuable source of guidance and direction for companies and individuals interested in the market.

Wafer Level Packaging Technologies Market Key Findings:
•Fan-out WLP is estimated to witness the highest growth rate in the market owing to its technological advances such as smaller form factor and thinner packaging with higher input/output (I/O) count along with improved thermal and electrical performance.
•In 2015, copper pillar led the overall WLP market revenue, and is projected to grow at a CAGR of 22.4% during the forecast period.
•Tin-lead eutectic solder is expected to witness comparatively slow growth rate due to government initiatives to ban toxic substances that have impacted its market heavily.
•Electronics industry constituted significant share in the overall WLP market in 2015 due to imminent need of size reduction in electronics devices, requirement of higher data transmission speed, and improvement in efficiency.
•In integration type of WLP, fan-in WLP dominated the market in 2015 owing to small, lightweight, high performance semiconductor packaging solution. .
•Asia-Pacific dominated the market in 2015 by accounting over 50% of the total market revenue.

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