Thin Wafer Processing and Dicing Equipment Market Outlook with Expected 6.0% CAGR 2019 – 2023 | Global Key Players - Suzhou Delphi Laser, SPTS Technologies, Plasma-Therm, Han's Laser Technology, DISCO, Tokyo Seimitsu, Neon Tech
Marketprognosis.com Publish a New Market Research Report On “Global Thin Wafer Processing and Dicing Equipment Market 2018 - 2023” which contains global key player’s survey information and forecast to 2023.Overview of the Global Thin Wafer Processing and Dicing Equipment Market:
The report spread across 101 pages is an overview of the Global Thin Wafer Processing and Dicing Equipment Market. These report study based on the Thin Wafer Processing and Dicing Equipment Market. It is a complete overview of the market, covering various aspects prevailing market landscape. It accumulates comprehensive information and research methodologies.
The Global Thin Wafer Processing and Dicing Equipment Market is expected to grow at a CAGR of over 6.0% during the forecast period (2018 - 2023).
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Integration of microelectronics into several consumer electronics and smart cards needed for thinner wafers are increasing rapidly. Technologies like RFID, MEMS Devices, and power devices are considered to be the major source of demand for these thin wafers. This scenario is increasingly creating demand for better manufacturing process, especially processing and dicing which are important phases of ultra-thin wafer production. Many new processes such as chemical mechanical polishing (CMP) are increasingly being integrated into the processing phase along with grinding operations to ensure smoothly polished wafer surface. With increasing innovations in enterprise security solutions to manage employees of the organization, upcoming foundries and semiconductor manufacturing establishments and applications in consumer electronics are expected to keep a steady demand for processing and dicing equipment over the forecast period
Radio Frequency Identification (RFID) is a major source of demand for wafer processing and dicing equipment. Generally, traditional methods of grinding or thinning are preferred to prepare wafers feasible for RFID applications. This involves grinding wafers as thin as 50 to 120 micrometers. But with most of the RFID technology being integrated into several consumer electronics and identity solutions such as smart cards and identification tags, end-users are increasingly asking for ultra-smooth surfaces and thinner wafers to incorporate them into these devices seamlessly.
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Asia Pacific is the fastest growing semiconductor market in the world. Growing initiatives like Make in India by the Indian government and Vision 2020 by the Chinese government are increasingly drawing attention from the international players to set up local production establishments. In case of India, the recent increment in customs duties on imported electronics is playing a pivotal role attracting companies like Apple to set up local manufacturing plants. According to the SEMI, a prominent global association serving the manufacturing supply chain of the electronics industry, more than 90% of the foundries being constructed in the world during 2017 was situated in the Asia Pacific. It is estimated that most of these foundries are concentrated in China and Japan. With initiatives for Tokyo Olympics 2020 already in motion, semiconductor manufacturing region is expected open up better opportunities for the thinning and dicing equipment shortly.
Major Key Players:
1 Suzhou Delphi Laser Co., Ltd
2 SPTS Technologies Limited (Orbotech)
3 Plasma-Therm LLC
4 Han's Laser Technology Co. Ltd
5 ASM Laser Separation International (ALSI) B.V.
6 DISCO Corporation
7 Tokyo Seimitsu Co., Ltd. (Accretech)
8 Neon Tech Co., Ltd
9 Nippon Pulse Motor Taiwan (NPMT) and More…………….
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What Information does this report contain?
1 A detailed analysis of regulatory trends, drivers, industry pitfalls, challenges and growth opportunities for participants
2 Which companies lead the industry, how are they positioned in the market in terms of sustainability, competency, production capacity and strategic outlook?
3 Which are the leading market products, applications & regions and how will they perform by 2023?
4 What are the technologies & innovation trends, how will they evolve by 2023?
In the end, this report covers data and information on capacity and production overview, production, market share analysis, sales overview, supply, sales, and shortage, import, export and consumption as well as cost, price, revenue and gross margin of Thin Wafer Processing and Dicing Equipment Market.
Table of Contents:
1 Introduction
2 Research Methodology
3 Executive Summary
4 Key Inferences
5 Market Overview
6 Drivers, Restraints, Opportunities and Challenges Analysis (Droc)
7 Market Segmentation
8 Competitive Landscape
9 Key Players
10 Future Outlook of the Market
About us:
We at Market Prognosis believe in giving a crystal clear view of market dynamics for achieving success in today’s complex and competitive marketplace through our quantitative & qualitative research methods.
We help our clients identify the best market insights and analysis required for their business thus enabling them to take strategic and intelligent decision.
We believe in delivering actionable insights for your business growth and success.
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