Press release
Semiconductor Packaging Equipments Market Trends, Growth and SWOT Analysis by Key Players: Applied Materials, ASM Pacific Technology, Kulicke and Soffa Industries, Tokyo Electron Limited, Tokyo Seimitsu
Accounting for more than 55% of the total market shares, the die-level packaging equipment segment dominated the market. This growth can be attributed to the increasing demand for application processors, basebands, and SoCs, which are integrated into mobile and consumer electronic devices. Though the market shares of this segment will decline due to the use of advanced technologies, this segment will continue to dominate the market throughout the forecast period.
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According to this market study, the OSATs will account for more than 58% of the total market shares and will also dominate the semiconductor packaging equipment market throughout the predicted period. The migration of a number of semiconductor manufacturers to the fabless model is identified to be the major factor for the growth of the market segment. Additionally, the development of new technologies such as FOWLP, 2.5D, and TSV has also increased the outsourcing of back-end processes, which will also fuel the growth of this market segment.
The global Semiconductor Packaging Equipments market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Semiconductor Packaging Equipments volume and value at global level, regional level and company level. From a global perspective, this report represents overall Semiconductor Packaging Equipments market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.
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The following manufacturers are covered:
Applied Materials
ASM Pacific Technology
Kulicke and Soffa Industries
Tokyo Electron Limited
Tokyo Seimitsu
ChipMos
Greatek
Hua Hong
Jiangsu Changjiang Electronics Technology
Lingsen Precision
Nepes
Tianshui Huatian
Unisem
Ultratech
Semiconductor Packaging Equipments Market Segment by Regions
North America
Europe
China
Japan
Semiconductor Packaging Equipments Market Segment by Type
Die-Level Packaging Equipment
Wafer-Level Packaging Equipment
Semiconductor Packaging Equipments Market Segment by Application
IDM (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test Companies)
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