Press release
Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market: Comprehensive Study Explores Huge Growth in Future: Leading Key Players- Nippon Mektron, ZD Tech, TTM Technologies, Unimicron, Sumitomo Denko, Compeq, Tripod, Samsung E-M, Young Po
Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market
Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.
Most PCB manufacturers are finding the demand for multilayer boards increasing by leaps and bounds. This growing demand is fed by the need for smaller, lighter boards for use in electrical devices, military equipment, healthcare miniaturization, and an expanding market for smart devices incorporated in home automation systems.
Smartphones and computers are perfect applications for multilayer PCBs with their need for compactness and light weight, yet sophisticated functionality.
Within the PCB market, the communication industry is expected to remain the largest market. Continuous innovations in smartphones and increasing demand from emerging economies are expected to spur growth for this segment over the forecast period.
According to this study, over the next five years the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market will register a 1.9% CAGR in terms of revenue, the global market size will reach US$ 25700 million by 2024, from US$ 23000 million in 2019. In particular, this report presents the global market share (sales and revenue) of key companies in Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) business, shared in Chapter 3.
This report presents a comprehensive overview, market shares and growth opportunities of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market by product type, application, key companies and key regions.
This study considers the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) value and volume generated from the sales of the following segments:
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This report studies the global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market, especially in North America, Europe, Asia-Pacific, South America, Middle East and Africa, focuses on the Global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) players in each region, with sales, price, revenue and market share from 2013 to 2019, the top players including
• Nippon Mektron
• ZD Tech
• TTM Technologies
• Unimicron
• Sumitomo Denko
• Compeq
• Tripod
• Samsung E-M
• Young Poong Group
• HannStar
• Ibiden
• Nanya PCB
• KBC PCB Group
• Daeduck Group
• ATandS
• Fujikura
• Meiko
• Multek
• Kinsus
• Chin Poon
• T.P.T.
• Shinko Denski
• Wus Group
• Simmtech
• Mflex
• CMK
• LG Innotek
• Gold Circuit
• Shennan Circuit
• Ellington
• Kinwong
• Founder Tech
• Dynamic
• Aoshikang
• Wuzhou
• CCTC
• SZ Fast Print
• Guangdong Xinda
• Shenzhen Suntak
• Redboard
Split by Product Types, with sales, revenue, price, market share of each type, can be divided into
• Layer 4-6
• Layer 8-10
• Layer 10+
Split by applications, this report focuses on sales, market share and growth rate of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) in each application, can be divided into
• Consumer Electronics
• Communications
• Computer Related Industry
• Automotive Industry
• Other
Browse full table of contents and data tables at
https://www.marketresearchnest.com/Global-Multilayer-Printed-Circuit-Board-Multilayer-Printed-wiring-Board-Market-Growth-2019-2024.html
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key players and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives:
• To study and analyze the global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market size by key regions/countries, product type and application, history data from 2014 to 2018, and forecast to 2024.
• To understand the structure of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) market by identifying its various subsegments.
• Focuses on the key global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) players, to define, describe and analyze the value, market share, market competition landscape, SWOT analysis and development plans in next few years.
• To analyze the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) with respect to individual growth trends, future prospects, and their contribution to the total market.
• To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
• To project the size of Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) submarkets, with respect to key regions (along with their respective key countries).
• To analyze competitive developments such as expansions, agreements, new product launches and acquisitions in the market.
• To strategically profile the key players and comprehensively analyze their growth strategies.
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https://www.marketresearchnest.com/report/purchase/546169
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