Thermal Interface Materials Market Key Insights and Opportunities Expected to Grow Till 2026 || Key Player - SEMIKRON, Wakefield-Vette Inc., DK THERMAL METAL CIRCUIT TECHNOLOGY LTD.

The expanding database of Market Research Reports Search Engine (MRRSE) has been recently updated by the addition of a new study which is titled as “Thermal Interface Materials Market Key Insights and Opportunities Expected to Grow Till 2026 – By MRRSE”. The fact based research report on global Thermal Interface Materials Market covers various aspects such as trends, drivers, challenges and opportunities that have an influence on the growth and expansion of the global market. All these factors are analysed across key regions of Latin America, North America, Europe, Middle and Africa (MEA) and Asia Pacific. In order to provide an accurate forecast, analysts have presented the current market, which forms the basis on how the metal caps and closures market is expected to develop in the future.

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Thermal interface materials are infused between two parts or surfaces in order to enhance thermal coupling between the two surfaces or parts. Usually, the machined surfaces are uneven, wavy, and rough. As a result, the two surfaces make contact at just a few points. These uneven surfaces create air gaps, which act as insulator for even small scale power applications. In order to avoid such complications, thermal interface materials are used between the two contact surfaces to provide better heat flow.

This report analyzes and forecasts the market for thermal interface materials at the global and regional level. The market has been forecast based on revenue (US$ Mn) from 2018 to 2026, considering 2017 as the base year. The study includes drivers and restraints of the global thermal interface materials market. It also covers impact of these drivers and restraints on the demand for thermal interface materials during the forecast period. The report also highlights opportunities in the thermal interface materials market at the global and regional level.

The report includes detailed value chain analysis, which provides a comprehensive view of the global thermal interface materials market. The Porter’s Five Forces model for the thermal interface materials market has also been included to help understand the competitive landscape in the market. The study encompasses market attractiveness analysis, wherein materials and applications are benchmarked based on their market size, growth rate, and general attractiveness.

The study provides a decisive view of the global thermal interface materials market by segmenting it in terms of material and application. Based on material, the thermal interface materials market can be classified into adhesives & greases, thermal tapes & films, gap fillers, thermal phase change materials, metal-based thermal interface materials, and others. In terms of application, the thermal interface materials market can be divided into computers, automotive electronics, industrial machinery, telecommunications, consumer durables, medical devices, and others. These segments have been analyzed based on present and future trends. Regional segmentation includes current and forecast demand for thermal interface materials in North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.

The report provides the actual market size of thermal interface materials for 2017 and estimated market size for 2018 with forecast for the next eight years. The global market for thermal interface materials has been provided in terms of revenue. Market revenue has been defined in US$ Mn. Market numbers have been estimated based on material and application of thermal interface materials. Market size has been provided in terms of global, regional, and country level markets.

The report comprises profiles of major companies operating in the global thermal interface materials market. Key players operating in the global thermal interface materials market include SEMIKRON, Wakefield-Vette, Inc., DK THERMAL METAL CIRCUIT TECHNOLOGY LTD, Indium Corporation, Momentive Performance Materials, Parker Hannifin Corp, Honeywell International Inc., 3M, Henkel AG & Company KGaA, Laird Technologies, and Dow Corning. Market players have been profiled in terms of attributes such as company overview, financial overview, business strategies, regional presence, and recent developments.

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The global thermal interface materials market has been segmented as follows:

Thermal Interface Materials Market, by Material

Adhesives & Greases
Thermal Tapes & Films
Gap Fillers
Thermal Phase Change Materials
Metal-based Thermal Interface Materials
Others

Thermal Interface Materials Market, by Application

Computers
Automotive Electronics
Industrial Machinery
Telecommunications
Consumer Durables
Medical Devices
Others

Thermal Interface Materials Market, by Region

North America
U.S.
Canada
Europe
Germany
U.K.
Russia & CIS
France
Italy
Rest of Europe
Asia Pacific
China
India
Japan
ASEAN
Rest of Asia Pacific
Latin America
Brazil
Mexico
Rest of Latin America
Middle East & Africa (MEA)
GCC
South Africa
Rest of Middle East & Africa

Key Takeaways

Extensive analysis of the thermal interface materials market trends and shares from 2017 to 2026 to identify market opportunities and analyze industry developments
In terms of application, the automotive electronics segment is anticipated to expand at a significant rate during the forecast period
Adhesives & greases is a major material segment of the thermal interface materials market
List of key factors responsible for building the upcoming opportunistic roadmap for the thermal interface materials market at global, regional, and country level
Insights into market opportunities for various stakeholders in the value chain and a detailed competition landscape for key players dominating the industry to understand competition level

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