3D Semiconductor Packaging Market 2019-2024 Perspective by Key Players Amkor Technology, SUSS Microtek, ASE Group, Sony Corp, Tokyo Electron, Siliconware Precision Industries Co., Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., International Bus

Global 3D Semiconductor Packaging Market share and size is giving soundness to the growth in parent economies and various leading regions. The Global 3D Semiconductor Packaging analysis is an evaluation that analyzes the progressing and notable trends alongside forecast to 2024. The study covers significant Global 3D Semiconductor Packaging assessment players, arrangements that are vital, and improvements in the market.

The 3D semiconductor packaging market trends which navigate unprecedented growth in 3D semiconductor packaging industry include, its advantages over other packaging technologies, lower cost, smaller size and enhanced efficiency. In 3D Through Silicon via (TSV) technology, the vertical connections are made through silicon die, and interconnect length is reduced drastically as compared to 2D technology where the connections are horizontal. The technological advantages of 3D packaging drive its demand in high-end applications such as chips used in super computers, DRAMS, NAND, microelectronic circuits, and others.

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The leading players profiled in this report are Amkor Technology,SUSS Microtek,ASE Group,Sony Corp,Tokyo Electron,Siliconware Precision Industries Co., Ltd.,Jiangsu Changjiang Electronics Technology Co. Ltd.,International Business Machines Corporation (IBM),Intel Corporation,Qualcomm Technologies, Inc.,STMicroelectronics, 3M Company, Advanced Semiconductor Engineering, Micron Technology, United Microelectronics, etc.

Based on applications, the global 3D semiconductor packaging market is dominated by the high demand shown for 3D wire bonding. The tremendous spur in the use of flash memory devices is creating a high demand for 3D wire bonding in electronics, primarily due to its already widespread usage and high market penetration. Flash memory is also being used on a large scale in robotics and consumer electronics, further fuelling the demand for 3D wire bonding.

Three-dimensional integrated circuits market can be segmented on the basis of materials which include organic substrates, underfill materials, lead frames, liquid encapsulants, bonding wire, wafer-level package dielectrics, thermal interface materials, mold compounds, die attach materials, and solder balls. Different end-use verticals include automotive, consumer electronics, aerospace, ICT, biomedical, research & development, and military applications. Consumer electronics as well as ICT are expected to be the key verticals engaged in adoption of integrated circuits, thereby enhancing market growth over the forecast period.

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The need to control the chip designing cost, which plays a major role in overall price of electronic devices; increase in demand for miniaturized circuits; and short replacement period of electronics products, which are constituted of integrated circuits manufactured with 3D packaging technology are the major factors that drive the growth in the 3D semiconductor packaging industry. However, high cost required to establish a 3D semiconductor packaging facility hinders the growth opportunities in 3D semiconductor packaging industry and this is anticipated to grow the overall 3D semiconductor packaging market size to three folds of the current value. On the contrary, the growth in trend of Internet of Things (IoT) and increase in number of wireless devices are opening new opportunities which will increase 3D semiconductor packaging market share in overall advanced packaging market.

The regional analysis of Global 3D Semiconductor Packaging Market is considered for the key regions such as North America, South America, Asia & Pacific, Europe, MEA (Middle East and Africa). The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players.

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