Substrate-Like PCB Market By Line/Space (25/25µm and 30/30µm Line/Space, Less Than 25/25 µm Line/Space), By Application (Automotive, Medical), By Geographic Scope Size And Forecast To 2026

Global Substrate-Like PCB Market Analysis

According to Verified Market Research, the Global Substrate-Like PCB Market was valued at USD 1.01 Billion in 2018 and is projected to reach USD 3.19 Billion by 2026, growing at a CAGR of 15.5% from 2019 to 2026.

What is Substrate-Like PCB?

Substrate-like PCBs (SLPs) are known to be the next evolution of high-end high-density interconnector PCBs with higher density. Substrate-like PCB technology will replace the previous HDI PCB technology. It is still a kind of rigid PCB, but its production process is more close to semiconductor specifications. Currently, the Substrate-like PCB has a requirement of line width/ line spacing of 30/30UM but its manufacturing process, raw materials, and design plan have not yet been determined. These PCBs are employed into smartphones such as iPhone 8 models and the iPhone X that will further contribute to revolutionizing the IC Substrate and PCB Markets.

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Global Substrate-Like PCB Market Outlook
In the report, the market outlook section mainly encompasses the fundamental dynamics of the market which include drivers, restraints, opportunities, and challenges faced by the industry. Drivers and Restraints are intrinsic factors whereas opportunities and challenges are extrinsic factors of the market.

The high adoption rate of SLPs by leading OEMs, growing demand for smart consumer electronics and wearable devices along with various benefits offered by SLPs have been driving the global substrate-like PCB market. On the other hand, higher setup costs associated with SLPs might act as a restraint for the overall market at a global level.

Verified Market Research narrows down the available data using primary sources to validate the data and use it in compiling a full-fledged market research study. The report contains a quantitative and qualitative estimation of market elements which interests the client. The “Global Substrate-Like PCB Market” is mainly bifurcated into sub-segments which can provide classified data regarding the latest trends in the market. This can be of great use in gaining knowledge about the cutting-edge technologies in the market.

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Global Substrate-Like PCB Market Competitive Landscape

The “Global Substrate-Like PCB Market” study report will provide a valuable insight with an emphasis on global market including some of the major players such as Kinsus Interconnect Technology, Ibiden, Compeq, Unimicron, AT&S, TTM Technologies and Samsung Electro-Mechanics Our market analysis also entails a section solely dedicated for such major players wherein our analysts provide an insight into the financial statements of all the major players, along with its product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share and market ranking analysis of the above-mentioned players globally.

Global Substrate-Like PCB Market Segmentation, by Line/Space

• 25/25µm and 30/30µm Line/Space
• Less Than 25/25 µm Line/Space

Global Substrate-Like PCB Market Segmentation, by Application

• Consumer Electronics
• Computing and Communications
• Automotive
• Medical
• Industrial
• Military, Defense, and Aerospace

Global Substrate-Like PCB Market Segmentation, by Inspection Technology

• Automated Optical Inspection (AOI)
• Direct Imaging (DI) Or Laser Direct Imaging (LDI)
• Automated Optical Shaping (AOS)

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Global Substrate-Like PCB Market Geographic Scope

• North America
o U.S.
o Canada
o Mexico
• Europe
o Germany
o UK
o France
o Rest of Europe
• Asia Pacific
o China
o Japan
o India
o Rest of Asia Pacific
• Latin America
o Brazil
• Rest of the World

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This release was published on openPR.