Press release
Global Semiconductor Assembly Equipments Market SWOT Analysis by Key Players: ASM Pacific Technology, Kulicke & Soffa Industries, Palomar Technologies, Tokyo Electron, Tokyo Seimitsu, Besi, ChipMOS Technologies, DIAS Automation Greatek Electronics, Hesse
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. Chip assembly basically involves attaching or joining two or more semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used for making interconnects between an IC or any other semiconductor device during assembly. This connection ensures the flow of electricity in the semiconductor device.
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The semiconductor assembly equipment market by die bonding equipment contributed to the maximum market shares during 2017 and the segment will continue its dominance during the estimated period as well. The growing demand for semiconductor chips from various end-user industries including energy, power, green cars, automobile, telecommunication, LED lighting, military, aerospace, and defense, and robotics, will positively influence the growth potential of this market segments.
The semiconductor assembly equipment market by OSATs dominated the market during 2017. The segment includes various players that are involved in packaging, assembly, and testing. The growth of the segment is determined by the overall growth of the semiconductor industry and the rising price of packaging, assembly, and testing equipment. According to this market research and analysis, this segment will continue to dominate the market throughout the forecast period.
The Semiconductor Assembly Equipments market was valued at xx Million US$ in 2017 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Semiconductor Assembly Equipments.
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The following manufacturers are covered in this report:
ASM Pacific Technology
Kulicke & Soffa Industries
Palomar Technologies
Tokyo Electron
Tokyo Seimitsu
Besi
ChipMOS Technologies
DIAS Automation
Greatek Electronics
Hesse Mechatronics
Hybond
Shinkawa
Toray Engineering
West Bond
Semiconductor Assembly Equipments Breakdown Data by Type
Die Bonding Equipment
Inspection and Dicing Equipment
Packaging Equipment
Wire Bonding Equipment
Plating Equipment
Other
Semiconductor Assembly Equipments Breakdown Data by Application
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Testing (OSATs)
Semiconductor Assembly Equipments Production by Region
United States
Europe
China
Japan
Other Regions
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