Molded Interconnect Device Market Global Research Report 2019 and Industrial Outlook 2023 by Type, Application, Top Key Players are Molex, TE Connectivity, HARTING, LPKF Laser & Electronics AG, TactoTek Group

The molded interconnect device report uses SWOT analysis to provide knowledge about the market’s strength and weakness and shows all the opportunity threats.

The global molded interconnect device market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of global molded interconnect device market for global, Europe, North America, Asia Pacific and South America.

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As per survey conducted by Statista, the number of connected installed devices in 2017 was at 20.35 billion while with current trends and increasing adaption the same is forecasted to surpass 75.44 billion by 2025. The total sale in the automotive industry was valued to be 81.5 million units.

Top Competitors/Players:

• MacDermind Inc.,
• Molex Llc,
• LPKF,
• TE Connectivity,
• HARTING Technology Group,
• Arlington Plating Company,
• Johnan America Inc.,
• MID Solutions GmbH,
• LaserMicronics,
• Yomura,
• TactoTek Corporation,
• DowDuPont (The Dow Chemical Company, DuPont),
• Multiple Dimensions AG,
• Galtronics USA ltd.,
• Teprosa GmbH,
• Cicor Management AG,
• 2E Mechatronic,
• RTP Company,
• TONGDA Group,
• S2P Smart Plastic Products S2P among others.

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Molded interconnected devices refer to devices interconnected to or molded with circuits to perform functions other than the devices primarily made for. For instance, the calling feature in the steering wheel, the function is made available by interconnecting systems of a headset and subsequent circuits being molded in the steering wheel of the car.

With continuous innovation and desire for new technology, the number of patents in molded interconnect devices (MID) has seen a two fold increase since 2010. Back in 20th century MID’s hailed as breakthrough innovation but failed drastically, today with cost optimization and new process along with materials and emergence of new technologies, it is easier for MIDs and manufacturers to penetrate in the market.

With an increase in the penetration of automation around all industrial verticals and decreasing size of sensors or miniaturisation of semiconductors and electronics, there is a need for molded interconnected devices at an increasing pace. Laser Direct Structuring alone is estimated to surpass USD 350 million till the forecast period.

Report Analysis

By Product Type (Antennae and Connectivity Modules, Sensors, Connectors and Switches, Lighting and Others),

By Process Type (Laser Direct Structuring, Two-shot Molding, Others),

By End Users (Automotive, Consumer Products, Healthcare, Industrial, Military and Aerospace, Telecommunication and Computing, and Others),

By Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa)

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