Dow Corning Corporation, Hybond Inc., Henkel, Alpha Assembly Solutions, Creative Materials Inc. - Are Some Industry Key Players of Global Die-Attach Materials Market

A fresh report has been added to the wide database of Market Research Report Search Engine (MRRSE). The research study is titled “Global Die-Attach Materials Market – Industry Analysis, Size, Share, Growth, Trends and Forecast 2018– 2026” which encloses important data about the production, consumption, revenue and market share, merged with information related to the market scope and product overview.

The evolving semiconductor industry has created new avenues for the use of electronic components in a range of devices. With growing use of electronic chips and chipsets, the demand for die-attach materials – a key constituent in the production of electronic boards – is witnessing an upsurge. High thermal conductivity, low-temperature sintering, and conducive to low costs are some of the key criterion influencing the sales of die-attach materials across the globe. An exclusive Transparency Market Research report reveals that by the end of 2026, nearly US$ 970 Mn worth of die-attach materials will be sold in the global semiconductors industry. The demand for die-attach materials, however, is estimated to incur restraints from production complexities, raw material procurement challenges and increasing technical expectations. During the forecast period, 2018-2026, the global die-attach materials market is pegged to expand at a sluggish CAGR of 3.1%.

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Increasing electrification of devices and tool has driven the demand for electronic circuit boards and electrical components such as die-attach materials. The evolving semiconductors industry is exhibiting a demand-supply gap as manufacturers of die-attach materials are unable expand their production capacities in the view of raw material procurement complexities. Moreover, there is an increasing pressure on the companies to make die-attach materials at the lowest costs for reducing the overall costs of electronic component manufacturing.

Transparency Market Research has developed an exclusive forecast study on the global die-attach materials market, projecting the future of die-attach materials in the world of semiconductors. The report provides market size estimations for the assessment period, 2018-2026. Inferences provided in the report serve as key insights for die-attach material manufacturers, and can enable them in planning their steps towards future market direction.

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The report provides an executive summary that outlines the key research findings and market size estimations. An overview of the global semiconductors industry, followed by an unbiased introduction to the global die-attach materials market is provided in the report. The report also classifies different types of die-attach materials present in the market. In addition, the report provides a distinct section analyzing the factors influencing the dynamic growth of the global die-attach materials market.

From industry trends to new applications, the report has analyzed every aspect of die-attach materials to depths. Analysis of supply chain, raw material sourcing strategies, and costing structure has been offered in the report. The study also offers an intensity map that reveals the presence of each market participant across global geographies. The report has provided detailed profiling of companies partaking in the growth of the global die-attach materials market. These companies have been profiled on the basis of their current market standings and strategic developments.

Transparency Market Research develops credible business documents that can help market participants form new strategies and change their traditional outlook. Through a slew of primary and secondary research methodologies, the report has been validated across multiple levels. The entire report has been quantified into US dollars (US$), wherein market size estimations have been interpreted across metrics such as compounded annual growth rates (CAGR), Year-on-Year (Y-o-Y) growth rates, and absolute dollar opportunities. Quantitative data and qualitative information have been blended to create precise forecast on the global die-attach materials market. Furthermore, the report has been developed by assessing the information procured from interviews conducted between analysts and company representatives. The scope of the report is to create new avenues for product development for the die-attach materials manufacturers by revealing valuable insights through its inferences.

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This release was published on openPR.