Extreme Ultraviolet Lithography Market Competitors Study 2018 (Nuflare Technology Inc., Cannon Inc., ASML, Intel Corporation, Nikon Corporation, Samsung Corporation, SUSS Microtec AG, Taiwan Semiconductor Manufacturing Company Limited)

Global Extreme Ultraviolet Lithography (EUVL) Market report is a window to the industry which explains what market definition, classifications, applications, engagements and market trends are. This market Report cover strategic profiling of key players in the market, comprehensively analyzing their core competencies, and drawing a competitive landscape for the market. Global Extreme Ultraviolet Lithography (EUVL) Market report also delivers lists of the leading competitors and provides the insights strategic industry Analysis of the key factors influencing the Industry. The numerical data is backed up by statistical tools such as SWOT analysis, Porter's Five Forces Analysis and else. The Global Extreme Ultraviolet Lithography (EUVL) Market is a professional and a detailed report focusing on primary and secondary drivers, market share, leading segments and geographical analysis.

Global Extreme Ultraviolet Lithography (EUVL) Market is expected to reach USD 9.02 billion by 2025 from USD 1.22 billion in 2017 and is projected to grow at a CAGR of 28.14% in the forecast period of 2018 to 2025.

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According to Statista, the consumer electronic segment amounts to USD 3, 01,311 million in 2018. Most of the revenue is generated from china. According to Statista, the European electronics consumer market is expected to account to USD 59,456 million in 2018 and it is estimated to grow by 78,903 million by 2020. Thus it shows that the electronics market is growing and boosting the demand for Extreme Ultraviolet Lithography (EUVL).

Extreme ultraviolet lithography (EUVL) is a next generation lithography technology that uses small wavelength to create circuits with small features and obtain better resolution output. Lithography is used to print complex patterns of semiconductor wafers defined by integrated circuit. To produce high power EUV radiation, discharge-produced plasma (DPP) and laser-produced plasma (LPP) are the noticeable technology used.

Key Competitors:

• Cannon Inc.,
• ASML,
• Intel Corporation,
• Nikon Corporation,
• Nuflare Technology Inc.,
• Samsung Corporation,
• SUSS Microtec AG,
• Taiwan Semiconductor Manufacturing Company Limited (Tsmc),
• Ultratech Inc.,
• Vistec Semiconductor Systems,
• Carl Zeiss,
• Toppan Printing,
• NTT Advanced Technology,
• Toshiba,
• Global foundries
• among other.

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Market Drivers and Restraints:

• Reduction in the complexity and cost
• Increasing trend of miniaturization
• High price of EUVL systems
• Complexity of design and infrastructure readiness.

Market Segmentation: Global Extreme Ultraviolet Lithography (EUVL) Market

• The market is based on end-user, equipment, light source and geographical segments.
• Based on end-user, the market is segmented into integrated device manufacturer (IDM), foundry, other.
• Based on equipment, the market is segmented into light source, optics, mask, others
• Based on light source, the market is segmented into laser produced plasmas (LPP), vacuum sparks, gas discharge.
• Based on geography, the market report covers data points for 28 countries across multiple geographies such as North America, South America, Europe, Asia-Pacific and Middle East & Africa. Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa, and Brazil among others.

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