Advanced Semiconductor Packaging Market Breakdown Data by Regions, Type, Manufacturers and Applications, Forecast 2017-2026

"Advanced semiconductor packaging market to bring in US$ 67,208.2 million revenue towards 2026 end, to increase to 10.9% CAGR throughout the forecast period 2017 - 2026."

The main objective of this report is to define, describe, and forecast the global “Advanced semiconductor packaging” market on the basis of types of applications, major sectors, deployment models, organization size, and regions. The report contains an analysis of the major factors influencing the growth of the market (drivers, restraints, opportunities, and challenges). It aims to strategically analyze the micromarkets with respect to individual growth trends, prospects, and their contribution to the market. The report attempts to forecast the market size for 5 major regions, namely, North America, Europe, Asia Pacific (APAC), Middle East and Africa (MEA), and Latin America. It contains key vendor profiles and comprehensively analyzes their core competencies. The report also tracks and analyzes competitive developments, including partnerships, collaborations, acquisitions, new product developments, and R&D activities in the market.

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Global Advanced Semiconductor Packaging Market- Overview

Semiconductor packaging prevents physical damage and corrosion of the chips that are to be connected to the circuit boards. In the recent years, semiconductor packaging has evolved giving rise to advanced semiconductor packaging technologies. Manufacturers are moving towards new packaging options such as 2.5D integrated circuits and 3D integrated circuits. Meanwhile, manufacturers are also focusing on developing an alternative to the 2.5D packaging.

Internet of Things (IoT) is also expected to have a significant impact on the advanced semiconductor packaging market. Hence, new packaging technologies supporting IoT driven semiconductor industry are being introduced. Miniaturization of devices and thermal dissipation are leading towards the growth of the advanced semiconductor packaging market. Meanwhile, the requirement for less power consumption, improved efficiency is driving the adoption of 3D semiconductor packaging in the advanced semiconductor packaging market.

Global Advanced Semiconductor Packaging Market- Research Methodology

The report on the global advanced semiconductor packaging market offers key insights on the market with help of the data obtained from primary and secondary research. The report has used top-down and bottom-up approach to provide expected market size. The report also offers insights on all the major factors playing an important role in the market growth. The report also includes key trends, market opportunities, factors driving the global market and factors hampering the growth of the market.

During the primary research interview of industry experts was conducted and information provided by them was crosschecked with various data sources. Both micro-economic and macro-economic factors were also taken into account to provide important information on the global as well as regional advanced semiconductor packaging market.

The report also offers segment-wise analysis and region-wise analysis of the global advanced semiconductor packaging market. The secondary research was done to gather data on the market. Sources used in the secondary research included investor presentations, annual reports and financial reports of the major companies. Absolute dollar opportunity is also provided in the report to identify various market opportunities.

The report comprises vital information on the key companies operating in the global advanced semiconductor packaging market. The report enlightens on the key business strategies, developments, new product launch by the key market players. The report also includes details on the regulations in the market across the globe. The report also focuses on the technological advancements in the market and how new technologies will impact the growth of the market in future.

Global Advanced Semiconductor Packaging Market- Segmentation

The global advanced semiconductor packaging market is segmented based on packaging type, application, end user, and region. On the basis of packaging type, the advanced semiconductor packaging market is divided into Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), and 2.5D/3D.

On the basis of application, the market is divided into application processor/ baseband, central processing units/graphical processing units, dynamic random access memory, NAND, image sensor, and other applications.

Based on the end user, the market is divided into telecommunications, automotive, aerospace and defense, medical devices, consumer electronics, and other end users.

Region-wise the global market for advanced semiconductor packaging is segmented into Japan, Asia Pacific Excluding Japan (APEJ), Europe, North America, Latin America, and the Middle East and Africa (MEA).

Competitive Landscape

Some of the key players in the global advanced semiconductor packaging market are Intel Corp, AMD, Amkor Technology, Hitachi Chemical, STMicroelectronics, Infineon, Sumitomo Chemical Co. Ltd., Avery Dennison, Kyocera, and ASE Group.

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Table of Content

1. Global Economic Outlook

2. Global Advanced Semiconductor Packaging Market - Executive Summary

3. Global Advanced Semiconductor Packaging Market Overview
3.1. Introduction
3.1.1. Global Advanced Semiconductor Packaging Market Taxonomy
3.1.2. Global Advanced Semiconductor Packaging Market Definition
3.2. Global Advanced Semiconductor Packaging Market Size (US$ Mn) and Forecast, 2012-2026
3.2.1. Global Advanced Semiconductor Packaging Market Y-o-Y Growth
3.3. Global Advanced Semiconductor Packaging Market Dynamics
3.4. Advanced Packaging Platforms
3.5. Semiconductor Industry Segmentation
3.6. World Semiconductor Spending
3.7. Competitor Footprint Matrix
3.8. Main Market Drivers for Power Application
3.9. Key Participants Market Presence (Intensity Map) By Region

4. Global Advanced Semiconductor Packaging Market Analysis and Forecast 2012-2026
4.1. Global Advanced Semiconductor Packaging Market Size and Forecast By Packaging Type, 2012-2026
4.1.1. Fan-Out Wafer-Level Packaging (FO WLP) Market Size and Forecast, 2012-2026
4.1.1.1. Revenue (US$ Mn) Comparison, By Region
4.1.1.2. Market Share Comparison, By Region
4.1.1.3. Y-o-Y growth Comparison, By Region
4.1.2. Fan-In Wafer-Level Packaging (FI WLP) Market Size and Forecast, 2012-2026
4.1.2.1. Revenue (US$ Mn) Comparison, By Region
4.1.2.2. Market Share Comparison, By Region
4.1.2.3. Y-o-Y growth Comparison, By Region
4.1.3. Flip Chip (FC) Market Size and Forecast, 2012-2026
4.1.3.1. Revenue (US$ Mn) Comparison, By Region
4.1.3.2. Market Share Comparison, By Region
4.1.3.3. Y-o-Y growth Comparison, By Region
4.1.4. 2.5D/3D Market Size and Forecast, 2012-2026
4.1.4.1. Revenue (US$ Mn) Comparison, By Region
4.1.4.2. Market Share Comparison, By Region
4.1.4.3. Y-o-Y growth Comparison, By Region
4.2. Global Advanced Semiconductor Packaging Market Size and Forecast By End User, 2012-2026
4.2.1. End User Processor/ Baseband Market Size and Forecast, 2012-2026
4.2.1.1. Revenue (US$ Mn) Comparison, By Region
4.2.1.2. Market Share Comparison, By Region
4.2.1.3. Y-o-Y growth Comparison, By Region
4.2.2. Central Processing Units/Graphical Processing Units Market Size and Forecast, 2012-2026
4.2.2.1. Revenue (US$ Mn) Comparison, By Region
4.2.2.2. Market Share Comparison, By Region
4.2.2.3. Y-o-Y growth Comparison, By Region
4.2.3. Dynamic Random Access Memory Market Size and Forecast, 2012-2026
4.2.3.1. Revenue (US$ Mn) Comparison, By Region
4.2.3.2. Market Share Comparison, By Region
4.2.3.3. Y-o-Y growth Comparison, By Region
4.2.4. NAND Market Size and Forecast, 2012-2026
4.2.4.1. Revenue (US$ Mn) Comparison, By Region
4.2.4.2. Market Share Comparison, By Region
4.2.4.3. Y-o-Y growth Comparison, By Region
4.2.5. Image Sensor Market Size and Forecast, 2012-2026
4.2.5.1. Revenue (US$ Mn) Comparison, By Region
4.2.5.2. Market Share Comparison, By Region
4.2.5.3. Y-o-Y growth Comparison, By Region
4.2.6. Other Applications Market Size and Forecast, 2012-2026
4.2.6.1. Revenue (US$ Mn) Comparison, By Region
4.2.6.2. Market Share Comparison, By Region
4.2.6.3. Y-o-Y growth Comparison, By Region
4.3. Global Advanced Semiconductor Packaging Market Size and Forecast By End User, 2012-2026
4.3.1. Telecommunications Market Size and Forecast, 2012-2026
4.3.1.1. Revenue (US$ Mn) Comparison, By Region
4.3.1.2. Market Share Comparison, By Region
4.3.1.3. Y-o-Y growth Comparison, By Region
4.3.2. Automotive Market Size and Forecast, 2012-2026
4.3.2.1. Revenue (US$ Mn) Comparison, By Region
4.3.2.2. Market Share Comparison, By Region
4.3.2.3. Y-o-Y growth Comparison, By Region
4.3.3. Aerospace and Defense Market Size and Forecast, 2012-2026
4.3.3.1. Revenue (US$ Mn) Comparison, By Region
4.3.3.2. Market Share Comparison, By Region
4.3.3.3. Y-o-Y growth Comparison, By Region
4.3.4. Medical Devices Market Size and Forecast, 2012-2026
4.3.4.1. Revenue (US$ Mn) Comparison, By Region
4.3.4.2. Market Share Comparison, By Region
4.3.4.3. Y-o-Y growth Comparison, By Region
4.3.5. Industrial Market Size and Forecast, 2012-2026
4.3.5.1. Revenue (US$ Mn) Comparison, By Region
4.3.5.2. Market Share Comparison, By Region
4.3.5.3. Y-o-Y growth Comparison, By Region
4.3.6. Consumer Electronics Market Size and Forecast, 2012-2026
4.3.6.1. Revenue (US$ Mn) Comparison, By Region
4.3.6.2. Market Share Comparison, By Region
4.3.6.3. Y-o-Y growth Comparison, By Region

5. North America Advanced Semiconductor Packaging Market Size and Forecast, 2012-2026
5.1. North America Outlook
5.2. North America Parent Market Outlook
5.3. North America Target Market Outlook
5.4. Revenue (US$ Mn) Comparison, By Country
5.4.1. US Market Size and Forecast (US$ Mn), 2012-2026
5.4.2. Canada Market Size and Forecast (US$ Mn), 2012-2026
5.5. Revenue (US$ Mn) Comparison, By Packaging Type
5.6. Revenue (US$ Mn) Comparison, By End User
5.7. Revenue (US$ Mn) Comparison, By End User

6. Latin America Advanced Semiconductor Packaging Market Size and Forecast, 2012-2026
6.1. Latin America Outlook
6.2. Latin America Parent Market Outlook
6.3. Latin America Target Market Outlook
6.4. Revenue (US$ Mn) Comparison, By Country
6.4.1. Brazil Market Size and Forecast (US$ Mn), 2012-2026
6.4.2. Mexico Market Size and Forecast (US$ Mn), 2012-2026
6.4.3. Rest of Latin America Market Size and Forecast (US$ Mn), 2012-2026
6.5. Revenue (US$ Mn) Comparison, By Packaging Type
6.6. Revenue (US$ Mn) Comparison, By End User
6.7. Revenue (US$ Mn) Comparison, By End User

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