Molded Interconnect Devices Market 2024 By Industry Players: Molex, TE Connectivity, Harting Mitronics AG, SelectConnect Technologies, RTP Company, MacDermid Enthone, LPKF Laser & Electronics, Galtronics, Multiple Dimensions AG, Teprosa GmbH, Yomura, Suzh

Market Overview: -

According to a new research report by Global Market Insights, Inc. (MID) Molded Interconnect Devices Market size is set to exceed USD 840 million by 2024. Molded Interconnect Devices (MID) market is poised to witness an accelerated growth over the ensuing years, amidst the backdrop of the frequent technological advancements in telecommunication sector. The ability of the device to facilitate miniaturization has largely added to the expansion of its application portfolio in a range of consumer products. MIDs have gradually become the prime circuitry solution choice in the automotive and electronics industry, owing to its easy assembling, smaller circuitry. and light weight when compared to conventional PCB circuits.

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Top Key Players: -

Players operating in the molded interconnect devices market include Molex, TE Connectivity, Harting Mitronics AG, SelectConnect Technologies, RTP Company, MacDermid Enthone, LPKF Laser & Electronics, Galtronics, Multiple Dimensions AG, Teprosa GmbH, Yomura, and Suzhou Cicor Technology Co., Ltd.

Market share calculation in this report is not done based on companies covered in it. The calculation of molded interconnect devices market share is done based on a regional approach and countries covered. On request, additional companies can be covered as well as regional data for particular country / countries can be provided.

Regional Segmentations: -

Japan is another prominent nation fueling APAC molded interconnect devices market growth. The region’s thriving automobile manufacturing industry is slated to be one of the top-notch regional drivers. With circuitry designed using MID facilitating the incorporation of these cutting-edge technological features, it is overt that APAC will be one of the most lucrative hubs for the MID market expansion. As per reliable estimates, overall APAC MID market is projected to surpass a valuation of USD 400 million by 2024.

The Chinese molded interconnect devices market is anticipated to dominate the industry be exceeding USD 155 million by 2024 owing to the rapid demand for MIDs in consumer electronics applications. Ease of manufacturing and availability of low-priced parts in China have favorably impacted the Asia Pacific molded interconnect device market growth. The growth of smartphone manufacturing industry in the region and the availability of a large number of component and material suppliers in China, South Korea, and Taiwan have favorably impacted regional MID market growth over the past few years.

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Partial Chapter of the Table of Content

Chapter 3. MID Industry Insights
3.1. Industry segmentation
3.2. Industry landscape, 2013 – 2024
3.2.1. MID industry landscape
3.2.1.1. MID market size & forecast, 2013 – 2024
3.2.1.1.1. North America
3.2.1.1.2. Europe
3.2.1.1.3. Asia Pacific
3.2.1.1.4. Latin America
3.2.1.1.5. MEA
3.2.2. Thermoplastic industry landscape
3.2.2.1. Thermoplastic market size & forecast, 2013 – 2024
3.2.2.1.1. North America
3.2.2.1.2. Europe
3.2.2.1.3. Asia Pacific
3.2.2.1.4. Latin America
3.2.2.1.5. MEA
3.2.3. PCB industry landscape
3.2.3.1. PCB market size & forecast, 2013 – 2024
3.2.3.1.1. North America
3.2.3.1.2. Europe
3.2.3.1.3. Asia Pacific
3.2.3.1.4. Latin America
3.2.3.1.5. MEA
3.2.4. Smartphone industry landscape
3.2.4.1. Smartphone thickness reduction trends
3.2.4.2. Smartphone antenna market
3.2.4.3. Smartphone market size & forecast, 2013 – 2024
3.2.4.3.1. North America
3.2.4.3.2. Europe
3.2.4.3.3. Asia Pacific
3.2.4.3.4. Latin America
3.2.4.3.5. MEA
3.3. Industry ecosystem analysis
3.3.1. Raw material suppliers
3.3.2. OEMs
3.3.3. Distribution channel analysis
3.3.4. Vendor Matrix
3.4. Technology landscape
3.4.1. Internet of Things (IoT)
3.4.2. Wearable devices
3.4.3. Software suites
3.5. Raw material analysis
3.5.1. Special polyamides (nylons)
3.5.2. Thermoplastic polyesters
3.5.2.1. Polybutylene Terephthalate (PBT)
3.5.2.2. Polyetherimide (PEI)
3.5.2.3. Polyphthalamides (PPA)
3.5.3. Liquid Crystal Polymers (LCP)
3.5.4. Acrylonitrile Butadiene Styrene (ABS)
3.6. LDS plating material analysis
3.6.1. Electroless copper
3.6.2. Electroless nickel
3.6.3. Immersion Gold
3.7. Regulatory landscape
3.7.1. Environmental regulations
3.7.1.1. RoHS
3.7.1.2. WEEE Directive
3.7.1.3. Others
3.7.2. ISO standards
3.8. Industry impact forces
3.8.1. Growth drivers
3.8.1.1. Proliferation of wearable devices in the U.S.
3.8.1.2. Favorable regulatory scenario for electronic waste reduction in the European Union
3.8.1.3. High demand from automotive industry across Germany, France, Italy
3.8.1.4. Surge in demand for smartphones in Asia Pacific
3.8.1.5. Growth of semiconductor manufacturing industry in China, South Korea, Taiwan
3.8.2. Industry pitfalls and challenges
3.8.2.1. Raw material price issues
3.8.2.2. High tooling cost
3.9. Growth potential analysis
3.10. Porter’s analysis
3.10.1. Threat of new entrants
3.10.2. Buyer power
3.10.3. Supplier power
3.10.4. Threat of substitutes
3.10.5. Industry rivalry
3.11. Competitive landscape, 2017
3.11.1. Company market share
3.11.2. Strategy dashboard
3.12. PESTEL analysis

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A major trend driving the molded interconnect devices market is the implementation of the devices for LDS in the automotive industry. These devices are used for reducing vehicle weight and increasing reliability owing to the benefits such as the elimination of circuits boards and wired circuitry. Rapid technological advancements in seatbelt safety system, position sensors, brake sensors, motorcycle LED lights, steering wheel hubs, and control switches are generating several opportunities for the industry growth.

Moreover, the devices provide video-based driving assistance by using vehicle camera systems, thereby strengthening the driver safety. Vehicle tracking systems are majorly implementing these devices in the LED displays and monitors to assist parking and traffic situations and monitor the driving behavior. Design flexibility and low cost of the solution are expected to drive the growth of the automotive molded interconnect device market.

About Global Market Insights

Global Market Insights, Inc., headquartered in Delaware, U.S., is a global market research and consulting service provider; offering syndicated and custom research reports along with growth consulting services. Our business intelligence and industry research reports offer clients with penetrative insights and actionable market data specially designed and presented to aid strategic decision making. These exhaustive reports are designed via a proprietary research methodology and are available for key industries such as chemicals, advanced materials, technology, renewable energy and biotechnology.

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