3D TSV Devices Market is trending with CAGR of 6.88% by 2023, Key Players- SONY, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, TELEDYNE DALSA, AMKOR TECHNOLOGY, XILINX, INVENSAS CORPORATION, TELEDYNE DALSA

The 3D TSV devices market is expected to register a CAGR of 6.88%, over the forecast period 2018 - 2023. The scope of the market is limited to the x-ray scanners for security purposes.
Driven by the rising demand for novel, high-performance chip architectures featuring advantages, such as greater performance, power utilization, and form factor features, 3D TSV technology is making healthy progress in the semiconductor industry. The development in the 3D TSV advanced wafer packaging technology market is presently fuelled by factors, such as strong outlook for the Information & Communication Technologies (ICT) sector, extension in communication services provider (CSP) operations, demand for advanced packaging, intensified activity in corporate data centers, and increasing propagation of cloud computing services.

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Consumer Electronics to Witness Significant Growth Over the Forecast Period
Leveraging its capability to deliver advanced integrated chip models with lesser footprint and decreased capacitance, 3D TSV technology is progressively being used in improving the memory, logic functions of electronics, CMOS, and non-memory, such as tablet PCs, smart phones, and televisions, among others. The propagation of 3D TSV in the DRAM memory vertical with pioneering technology platforms, such as Wide I/O, High Bandwidth Memory (HBM), and Hybrid Memory Cube (HMC) is also contributing to the market growth.

Key Developments
May 2017: Amkor Technology acquired Nanium SA, a manufacturer of WLFO technology. The acquisition is aimed at strengthening Amkor in the fast-growing market of wafer-level packaging for smartphones, tablets, and other applications

Major Players:
SONY CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, TELEDYNE DALSA INC., AMKOR TECHNOLOGY INC., XILINX INC., INVENSAS CORPORATION, TELEDYNE DALSA INC. , SAMSUNG ELECTRONICS CO. LTD, MICRON TECHNOLOGY INC. AND UNITED MICROELECTRONICS CORPORATION, amongst others.

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China to Hold the Largest Market Share in Asia-Pacific
China, a major manufacturer and the largest exporter of consumer electronics across the world, is supported by the huge research and development (R&D) investments in cutting-edge technology and shorter product development cycles, which have further driven the exports of electronic goods all over the world. To cater to the various advancements in consumer applications, such as, smartphones, tablets and wearable products, the MEMS and CIS markets are expected to exhibit a robust growth over the forecast period, in turn, fueling the growth of the 3D TSV devices market. All these factors are expected to drive the market for 3D TSV devices.

Adoption of Cloud-based Storage and Cloud Computing By Enterprises to Drive the Market Over the Forecast Period
The adoption of cloud for data storage has been witnessed across various enterprises around the world, since the commercial data requires a large storage space, varying from large firms to SME’s. With the advent of IoT and big data analytics there is a rising amount of data being generated. Since, on-premise storage of these huge amounts of data becomes expensive, many enterprises have started moving their data to the cloud storage by selecting service providers, such as Microsoft Azure, AWS, and Google Cloud Platform. 3D TSV has a major role to play as it provides high speed data transmitting while maintaining power budget, a major requirement for cloud storage and cloud computing. Thus, the increase in the adoption of cloud-based storage is expected to fuel the demand for 3D TSV devices market during the forecast period.

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