Press release
Global Semiconductor Packaging Material Market 2018 Competitive Major Vendors - Alent plc (U.K.), LG Chem (South Korea), BASF SE (Germany)
This report researches the worldwide Semiconductor Packaging Material market size (value, capacity, production and consumption) in key regions like North America, Europe, Asia Pacific (China, Japan) and other regions.
This study categorizes the global Semiconductor Packaging Material breakdown data by manufacturers, region, type and application, also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
Semiconductor packaging materials are used in the final stage of semiconductor device fabrication and are used to safeguard devices from deterioration and external influence.
The Asia Pacific currently holds the pole position in the semiconductor packaging material market owing to fast technological growths and the developing demand for progressive electronic packaging materials from the end-users. Furthermore, the large investments in electronics applications along with low-cost manufacturing, low workforce cost, and easy convenience of the raw materials are subsidizing to the evolution of the region.
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This report focuses on the top manufacturers' Semiconductor Packaging Material capacity, production, value, price and market share of Semiconductor Packaging Material in global market. The following manufacturers are covered in this report:
Henkel AG & Company
KGaA (Germany)
Hitachi Chemical Company, Ltd. (Japan)
Sumitomo Chemical Co., Ltd. (Japan)
Kyocera Chemical Corporation (Japan)
Mitsui High-tec, Inc. (Japan)
Toray Industries, Inc. (Japan)
Alent plc (U.K.)
LG Chem (South Korea)
BASF SE (Germany)
Tanaka Kikinzoku Group (Japan)
E. I. du Pont de Nemours and Company (U.S.)
Honeywell International Inc. (U.S.)
Toppan Printing Co., Ltd. (Japan)
Semiconductor Packaging Material Breakdown Data by Type
Organic Substrates
Bonding Wires
Encapsulation Resins
Ceramic Packages
Solder Balls
Wafer Level Packaging Dielectrics
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Semiconductor Packaging Material Consumption Breakdown Data by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
The study objectives are:
To analyze and research the global Semiconductor Packaging Material capacity, production, value, consumption, status and forecast;
To focus on the key Semiconductor Packaging Material manufacturers and study the capacity, production, value, market share and development plans in next few years.
To focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
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