Press release
Global Wafer Grinding Equipment Industry Research Report, Growth Trends and Competitive Analysis 2018-2025
In terms of production side, this report researches the Wafer Grinding Equipment capacity, production, value, ex-factory price, growth rate, market share for major manufacturers, regions (or countries) and product type.
In terms of consumption side, this report focuses on the consumption of Wafer Grinding Equipment by regions and application. The key regions like North America, Europe, Asia-Pacific, Central & South America, Middle East and Africa etc.
This report covers Wafer Edge Grinder and Wafer Surface Grinder in Semiconductor and Photovoltaic field.
The Wafer Grinding Equipment market was valued at xx Million US$ in 2017 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Wafer Grinding Equipment.
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This report includes the following manufacturers; we can also add the other companies as you want.
Okamoto Semiconductor Equipment Division
Strasbaugh
Disco
G&N Genauigkeits Maschinenbau Nürnberg GmbH
GigaMat
Arnold Gruppe
Hunan Yujing Machine Industrial
WAIDA MFG
SpeedFam
Koyo Machinery
ACCRETECH
Daitron
MAT Inc.
Dikema Presicion Machinery
Dynavest
Komatsu NTC
Market Segment by Product Type
Wafer Edge Grinder
Wafer Surface Grinder
Market Segment by Application
Semiconductor
Photovoltaic
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QY Research established in 2007, focus on custom research, management consulting, IPO consulting, industry chain research, data base and seminar services. The company owned a large basic data base (such as National Bureau of statistics database, Customs import and export database, Industry Association Database etc), expert’s resources (included energy automotive chemical medical ICT consumer goods etc.
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