Press release
Global Wafer Level Packaging Market : Industry Size, Share, Growth, Forecasts 2018
This report studies the global Wafer Level Packaging market status and forecast, categorizes the global Wafer Level Packaging market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).
Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them. WLP is essentially a true chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die.[1] Wafer-level packaging allows integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.
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Wafer-level packaging consists of extending the wafer fab processes to include device interconnection and device protection processes. Most other kinds of packaging do wafer dicing first, and then put the individual die in a plastic package and attach the solder bumps. Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing.
There is no single industry-standard method of wafer-level packaging at present.
A major application area of WLPs are smartphones due to the size constraints.
The global Wafer Level Packaging market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018-2025.
The major manufacturers covered in this report
Amkor Technology Inc
Fujitsu Ltd
Jiangsu Changjiang Electronics
Deca Technologies
Qualcomm Inc
Toshiba Corp
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
KLA-Tencor Corration
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Nanium SA
STATS Chip
PAC Ltd
Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
North America
Europe
China
Japan
India
Southeast Asia
Other regions (Central & South America, Middle East & Africa)
We can also provide the customized separate regional or country-level reports, for the following regions:
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Singapore
Rest of Asia-Pacific
Europe
Germany
France
UK
Italy
Spain
Russia
Rest of Europe
Central & South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Saudi Arabia
Turkey
Rest of Middle East & Africa
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP
Others ( 2D TSV WLP and Compliant WLP)
By Application, the market can be split into
Electronics
IT & Telecommunication
Industrial
Automotive
Aerospace & Defense
Healthcare
Others (Media & Entertainment and Non-Conventional Energy Resources)
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The study objectives of this report are:
To analyze and study the global Wafer Level Packaging capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);
Focuses on the key Wafer Level Packaging manufacturers, to study the capacity, production, value, market share and development plans in future.
Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
In this study, the years considered to estimate the market size of Wafer Level Packaging are as follows:
History Year: 2013-2017
Base Year: 2017
Estimated Year: 2018
Forecast Year 2018 to 2025
For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Key Stakeholders
Wafer Level Packaging Manufacturers
Wafer Level Packaging Distributors/Traders/Wholesalers
Wafer Level Packaging Subcomponent Manufacturers
Industry Association
Downstream Vendors
Available Customizations
With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:
Regional and country-level analysis of the Wafer Level Packaging market, by end-use.
Detailed analysis and profiles of additional market players.
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Table of Contents
Global Wafer Level Packaging Market Professional Survey Report 2018
1 Industry Overview of Wafer Level Packaging
1.1 Definition and Specifications of Wafer Level Packaging
1.1.1 Definition of Wafer Level Packaging
1.1.2 Specifications of Wafer Level Packaging
1.2 Classification of Wafer Level Packaging
1.2.1 3D TSV WLP
1.2.2 2.5D TSV WLP
1.2.3 WLCSP
1.2.4 Nano WLP
1.2.5 Others ( 2D TSV WLP and Compliant WLP)
1.3 Applications of Wafer Level Packaging
1.3.1 Electronics
1.3.2 IT & Telecommunication
1.3.3 Industrial
1.3.4 Automotive
1.3.5 Aerospace & Defense
1.3.6 Healthcare
1.3.7 Others (Media & Entertainment and Non-Conventional Energy Resources)
1.4 Market Segment by Regions
1.4.1 North America
1.4.2 Europe
1.4.3 China
1.4.4 Japan
1.4.5 Southeast Asia
1.4.6 India
2 Manufacturing Cost Structure Analysis of Wafer Level Packaging
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Wafer Level Packaging
2.3 Manufacturing Process Analysis of Wafer Level Packaging
2.4 Industry Chain Structure of Wafer Level Packaging
3 Technical Data and Manufacturing Plants Analysis of Wafer Level Packaging
3.1 Capacity and Commercial Production Date of Global Wafer Level Packaging Major Manufacturers in 2017
3.2 Manufacturing Plants Distribution of Global Wafer Level Packaging Major Manufacturers in 2017
3.3 R&D Status and Technology Source of Global Wafer Level Packaging Major Manufacturers in 2017
3.4 Raw Materials Sources Analysis of Global Wafer Level Packaging Major Manufacturers in 2017
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