Global Semiconductor Packaging Equipments Market Insights, Forecast to 2025

This report presents the worldwide Semiconductor Packaging Equipments market size (value, production and consumption), splits the breakdown (data status 2013-2018 and forecast to 2025), by manufacturers, region, type and application.

This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.

Accounting for more than 55% of the total market shares, the die-level packaging equipment segment dominated the market. This growth can be attributed to the increasing demand for application processors, basebands, and SoCs, which are integrated into mobile and consumer electronic devices. Though the market shares of this segment will decline due to the use of advanced technologies, this segment will continue to dominate the market throughout the forecast period.

According to this market study, the OSATs will account for more than 58% of the total market shares and will also dominate the semiconductor packaging equipment market throughout the predicted period. The migration of a number of semiconductor manufacturers to the fabless model is identified to be the major factor for the growth of the market segment. Additionally, the development of new technologies such as FOWLP, 2.5D, and TSV has also increased the outsourcing of back-end processes, which will also fuel the growth of this market segment.

The following manufacturers are covered in this report:

    Applied Materials

    ASM Pacific Technology

    Kulicke and Soffa Industries

    Tokyo Electron Limited

    Tokyo Seimitsu

    ChipMos

    Greatek

    Hua Hong

    Jiangsu Changjiang Electronics Technology

    Lingsen Precision

    Nepes

    Tianshui Huatian

    Unisem

    Ultratech

Semiconductor Packaging Equipments Breakdown Data by Type

    Die-Level Packaging Equipment

    Wafer-Level Packaging Equipment

Semiconductor Packaging Equipments Breakdown Data by Application

    IDM (Integrated Device Manufacturers)

    OSAT (Outsourced Semiconductor Assembly and Test Companies)

Semiconductor Packaging Equipments Production by Region

    United States

    Europe

    China

    Japan

    Other Regions

    Other Regions

The study objectives are:

    To analyze and research the global Semiconductor Packaging Equipments status and future forecast，involving, production, revenue, consumption, historical and forecast.

    To present the key Semiconductor Packaging Equipments manufacturers, production, revenue, market share, and recent development.

    To split the breakdown data by regions, type, manufacturers and applications.

    To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.

    To identify significant trends, drivers, influence factors in global and regions.

    To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

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QY Research established in 2007, focus on custom research, management consulting, IPO consulting, industry chain research, data base and seminar services. The company owned a large basic data base (such as National Bureau of statistics database, Customs import and export database, Industry Association Database etc), expert’s resources (included energy automotive chemical medical ICT consumer goods etc.

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