Global Semiconductor Assembly Equipments Market Expected to Witness a Sustainable Growth over 2025 - QY Research

This report presents the worldwide Semiconductor Assembly Equipments market size (value, production and consumption), splits the breakdown (data status 2013-2018 and forecast to 2025), by manufacturers, region, type and application.

This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

Semiconductor chip assembly is a key component of the semiconductor supply chain. It is a part of the back-end process of chip formation. Chip assembly basically involves attaching or joining two or more semiconductor wafers or semiconductor devices to increase the functionality of chips. Machinery is used for making interconnects between an IC or any other semiconductor device during assembly. This connection ensures the flow of electricity in the semiconductor device.

The semiconductor assembly equipment market by die bonding equipment contributed to the maximum market shares during 2017 and the segment will continue its dominance during the estimated period as well. The growing demand for semiconductor chips from various end-user industries including energy, power, green cars, automobile, telecommunication, LED lighting, military, aerospace, and defense, and robotics, will positively influence the growth potential of this market segments.

The semiconductor assembly equipment market by OSATs dominated the market during 2017. The segment includes various players that are involved in packaging, assembly, and testing. The growth of the segment is determined by the overall growth of the semiconductor industry and the rising price of packaging, assembly, and testing equipment. According to this market research and analysis, this segment will continue to dominate the market throughout the forecast period.

The following manufacturers are covered in this report:
    ASM Pacific Technology
    Kulicke & Soffa Industries
    Palomar Technologies
    Tokyo Electron
    Tokyo Seimitsu
    Besi
    ChipMOS Technologies
    DIAS Automation
    Greatek Electronics
    Hesse Mechatronics
    Hybond
    Shinkawa
    Toray Engineering
    West Bond

Semiconductor Assembly Equipments Breakdown Data by Type
    Die Bonding Equipment
    Inspection and Dicing Equipment
    Packaging Equipment
    Wire Bonding Equipment
    Plating Equipment
    Other

Semiconductor Assembly Equipments Breakdown Data by Application
    Integrated Device Manufacturer (IDMs)
    Outsourced Semiconductor Assembly and Testing (OSATs)

Semiconductor Assembly Equipments Production by Region
    United States
    Europe
    China
    Japan
    Other Regions
    Other Regions

The study objectives are:
    To analyze and research the global Semiconductor Assembly Equipments status and future forecast,involving, production, revenue, consumption, historical and forecast.
    To present the key Semiconductor Assembly Equipments manufacturers, production, revenue, market share, and recent development.
    To split the breakdown data by regions, type, manufacturers and applications.
    To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
    To identify significant trends, drivers, influence factors in global and regions.
    To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

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QY Research established in 2007, focus on custom research, management consulting, IPO consulting, industry chain research, data base and seminar services. The company owned a large basic data base (such as National Bureau of statistics database, Customs import and export database, Industry Association Database etc), expert’s resources (included energy automotive chemical medical ICT consumer goods etc.

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