Press release
Asia-Pacific Wafer Grinder Market Analysis and Forecasts of 2018–2025
This report studies the Wafer Grinder market status and outlook of Asia-Pacific and major countries, from angles of players, regions, product types and end industries; this report analyzes the top players in Asia-Pacific and major countries, and splits the Wafer Grinder market by product type and applications/end industries.The major players in Asia-Pacific Wafer Grinder market include
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
Beijing Dianke Electronic Equipment
Koyo Machinery
Revasum
Daitron
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam
Other
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Geographically, this report is segmented into several key Regions, with consumption, revenue, market share and growth rate of Wafer Grinder in these regions, from 2013 to 2025 (forecast), covering
Japan
China
South Korea
Taiwan
Southeast Asia
India
Others
On the basis of product, the Wafer Grinder market is primarily split into
Wafer Edge Grinder
Wafer Surface Grinder
On the basis on the end users/applications, this report covers
Silicon Wafer
Compound Semiconductors
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QY Research established in 2007, focus on custom research, management consulting, IPO consulting, industry chain research, data base and seminar services. The company owned a large basic data base (such as National Bureau of statistics database, Customs import and export database, Industry Association Database etc), expert’s resources (included energy automotive chemical medical ICT consumer goods etc.
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