Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Global Market Top Key Players – Nippon Mektron, ZD Tech, TTM Technologies, Unimicron , Sumitomo Denko and Forecast to 2023
Global Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) MarketWiseGuyRerports.com Presents “Global (North America, Europe, Asia-Pacific, South America, Middle East and Africa) Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market 2018, Forecast to 2023” New Document to its Studies Database. The Report Contain 153 Pages With Detailed Analysis.
Description
Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.
Scope of the Report:
This report focuses on the Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Most PCB manufacturers are finding the demand for multilayer boards increasing by leaps and bounds. This growing demand is fed by the need for smaller, lighter boards for use in electrical devices, military equipment, healthcare miniaturization, and an expanding market for smart devices incorporated in home automation systems.
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The worldwide market for Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) is expected to grow at a CAGR of roughly 1.9% over the next five years, will reach 25700 million US$ in 2023, from 23000 million US$ in 2017, according to a new GIR (Global Info Research) study.
Market Segment by Manufacturers, this report covers
Nippon Mektron
ZD Tech
TTM Technologies
Unimicron
Sumitomo Denko
Compeq
Tripod
Samsung E-M
Young Poong Group
HannStar
Ibiden
Nanya PCB
KBC PCB Group
Daeduck Group
AT&S
Fujikura
Meiko
Multek
Kinsus
Chin Poon
T.P.T.
Shinko Denski
Wus Group
Simmtech
Mflex
CMK
LG Innotek
Gold Circuit
Shennan Circuit
Ellington
Kinwong
Founder Tech
Dynamic
Aoshikang
Wuzhou
CCTC
SZ Fast Print
Guangdong Xinda
Shenzhen Suntak
Redboard
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Layer 4-6
Layer 8-10
Layer 10+
Market Segment by Applications, can be divided into
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Other
Complete Report Details @ https://www.wiseguyreports.com/reports/3326604-global-north-america-europe-asia-pacific-south-america
Table of Contents -Major Key Points
1 Market Overview
1.1 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Introduction
1.2 Market Analysis by Type
1.2.1 Layer 4-6
1.2.2 Layer 8-10
1.2.3 Layer 10+
1.3 Market Analysis by Applications
1.3.1 Consumer Electronics
1.3.2 Communications
1.3.3 Computer Related Industry
1.3.4 Automotive Industry
1.3.5 Other
1.4 Market Analysis by Regions
1.4.1 North America (United States, Canada and Mexico)
1.4.1.1 United States Market States and Outlook (2013-2023)
1.4.1.2 Canada Market States and Outlook (2013-2023)
1.4.1.3 Mexico Market States and Outlook (2013-2023)
1.4.2 Europe (Germany, France, UK, Russia and Italy)
1.4.2.1 Germany Market States and Outlook (2013-2023)
1.4.2.2 France Market States and Outlook (2013-2023)
1.4.2.3 UK Market States and Outlook (2013-2023)
1.4.2.4 Russia Market States and Outlook (2013-2023)
1.4.2.5 Italy Market States and Outlook (2013-2023)
1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
1.4.3.1 China Market States and Outlook (2013-2023)
1.4.3.2 Japan Market States and Outlook (2013-2023)
1.4.3.3 Korea Market States and Outlook (2013-2023)
1.4.3.4 India Market States and Outlook (2013-2023)
1.4.3.5 Southeast Asia Market States and Outlook (2013-2023)
1.4.4 South America, Middle East and Africa
1.4.4.1 Brazil Market States and Outlook (2013-2023)
1.4.4.2 Egypt Market States and Outlook (2013-2023)
1.4.4.3 Saudi Arabia Market States and Outlook (2013-2023)
1.4.4.4 South Africa Market States and Outlook (2013-2023)
1.4.4.5 Nigeria Market States and Outlook (2013-2023)
1.5 Market Dynamics
1.5.1 Market Opportunities
1.5.2 Market Risk
1.5.3 Market Driving Force
2 Manufacturers Profiles
2.1 Nippon Mektron
2.1.1 Business Overview
2.1.1.1 Nippon Mektron Description
2.1.1.2 Nippon Mektron Headquarter, Main Business and Finance Overview
2.1.2 Nippon Mektron Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Introduction
2.1.2.1 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Production Bases, Sales Regions and Major Competitors
2.1.2.2 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Information
2.1.3 Nippon Mektron Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.1.3.1 Nippon Mektron Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.1.3.2 Global Nippon Mektron Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market Share in 2017
2.2 ZD Tech
2.2.1 Business Overview
2.2.1.1 ZD Tech Description
2.2.1.2 ZD Tech Headquarter, Main Business and Finance Overview
2.2.2 ZD Tech Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Introduction
2.2.2.1 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Production Bases, Sales Regions and Major Competitors
2.2.2.2 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Information
2.2.3 ZD Tech Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.2.3.1 ZD Tech Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.2.3.2 Global ZD Tech Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market Share in 2017
2.3 TTM Technologies
2.3.1 Business Overview
2.3.1.1 TTM Technologies Description
2.3.1.2 TTM Technologies Headquarter, Main Business and Finance Overview
2.3.2 TTM Technologies Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Introduction
2.3.2.1 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Production Bases, Sales Regions and Major Competitors
2.3.2.2 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Information
2.3.3 TTM Technologies Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.3.3.1 TTM Technologies Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.3.3.2 Global TTM Technologies Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market Share in 2017
2.4 Unimicron
2.4.1 Business Overview
2.4.1.1 Unimicron Description
2.4.1.2 Unimicron Headquarter, Main Business and Finance Overview
2.4.2 Unimicron Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Introduction
2.4.2.1 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Production Bases, Sales Regions and Major Competitors
2.4.2.2 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Information
2.4.3 Unimicron Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.4.3.1 Unimicron Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.4.3.2 Global Unimicron Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market Share in 2017
2.5 Sumitomo Denko
2.5.1 Business Overview
2.5.1.1 Sumitomo Denko Description
2.5.1.2 Sumitomo Denko Headquarter, Main Business and Finance Overview
2.5.2 Sumitomo Denko Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Introduction
2.5.2.1 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Production Bases, Sales Regions and Major Competitors
2.5.2.2 Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Product Information
2.5.3 Sumitomo Denko Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.5.3.1 Sumitomo Denko Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.5.3.2 Global Sumitomo Denko Multilayer Printed Circuit Board (Multilayer Printed-wiring Board) Market Share in 2017
……..CONTINUED
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