08-07-2018 04:06 PM CET - IT, New Media & Software
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Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market 2018: Forecasting Players Micron Technology, SAMSUNG, SK HYNIX, Advanced Micro Devices, Intel Corporation, XILINX INC., FUJITSU

Press release from: Data Bridge Market Research
Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM)
Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM)


The global market has seen an outstanding growth over the past few years and it's been expected that the worldwide Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market would see a major growth throughout the forecast amount. This growth are often attributed to the growing marketplace for application section all across the world. during this epoch, the technology has reformed within the telecom sector wherever the demand has attracted the makers also as memory. Over the last decade, the development business is on its peak purpose And has created an ample quantity of growth opportunities within the market. Rising memory processing square measure increasing their disbursement notably on IT infrastructure. to boot, the fast urbanization, growing IT sector, many advantages of memory square measure the key driving factors.

The Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) market report contains data for historic years 2014 & 2015, the base year of calculation is 2016 and the forecast period is 2018 to 2025. Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market Segmented By Memory Type (Hybrid Memory Cube (HMC), High-Bandwidth Memory (HBM)) , By Product Type (Central Processing Unit, Field-Programmable Gate Array, Graphics Processing Unit, Application-Specific Integrated Circuit, Accelerated Processing Unit),By Application (High-Performance Computing (HPC), Networking, Data Centres, Graphics), By Geography(North America, Asia Pacific, South America and others) With Industry Trends and Forecast to 2025. The Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market is expected to reach USD 3925.5 Million by 2025, from USD 573.5 Million in 2017, growing at a CAGR of 34.5% during the forecast period of 2018 to 2025.

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The report includes market shares of hybrid memory cube (HMC) and high-bandwidth memory (HBM) market for global, Europe, North America, Asia pacific and South America.

Major Market Competitors/Players: Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market

The global hybrid memory cube (HMC) and high-bandwidth memory (HBM)market is highly fragmented and the major players have used various strategies such as new product launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. Some of the major players operating in the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market are

• Micron Technology, Inc.,
• SAMSUNG,
• SK HYNIX INC. ,
• Advanced Micro Devices, Inc. ,
• Intel Corporation,
• XILINX INC. ,
• FUJITSU,
• NVIDIA Corporation,
Others: IBM India Private Limited, Open-Silicon, Inc., Arira Design, Inc., Cadence Design Systems, Inc., Cray Inc., Rambus.com., Marvell, Arm Limited., among others.

Major Market Drivers:
• Increasing demand for high-bandwidth, low power consuming, and highly scalable memories.
• Growth in acceptance of artificial intelligence.
• Electronic devices miniatures are in trend.
Restraints:
• High levels integration increase thermal issues.

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Market Segmentation: Global Hybrid Memory Cube (HMC) and High-Bandwidth Memory (HBM) Market

• The global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is segmented into memory, product, application, and by geography.

• Based on memory, the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is segmented into hybrid memory cube (HMC) and high-bandwidth memory (HBM)).

• On the basis of product type, the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is segmented into central processing unit, field-programmable gate array, graphics processing unit, application-specific integrated circuit, and accelerated processing unit.

• On the basis of application, the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market is segmented into high-performance computing (HPC), networking, data centres, and graphics.

• Based on geography, the global hybrid memory cube (HMC) and high-bandwidth memory (HBM) market report covers data points for 28 countries across multiple geographies namely north America & south America, Europe, Asia-Pacific And, Middle East & Africa. Some of the major countries covered in this report are U.S., Canada, Germany, France, U.K., Netherlands, Switzerland, Turkey, Russia, China, India, South Korea, Japan, Australia, Singapore, Saudi Arabia, South Africa and, Brazil among others.

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