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TCB Bonder Market will reach 140 million US$ by the end of 2025-QY Research, Inc.

07-17-2018 08:27 AM CET | Advertising, Media Consulting, Marketing Research

Press release from: QY Research, Inc. 

TCB Bonder Market will reach 140 million US$ by the end of 2025-QY

This report studies the global TCB Bonder market status and forecast, categorizes the global TCB Bonder market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, and other regions (India, Southeast Asia, Central & South America, and Middle East & Africa).

Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the die in a process called "Thermo Compression Bonding". The bumps are forced against their opposing pads and a second metallic bond is formed where the bond comes into contact with the package metallization. This technique typically requires the use of heat as high as 350° to 400°C, and forces of as much as 100 g/bump.

Thermo Compression Bonding (TCB) is a chip attach technology under investigation and implementation in multiple platforms. The global TCB Bonder market is driven by increased TCB Bonder usage: memory applications currently, logic devices next. Meanwhile, TCB Bonder is gaining market share from wire bond assembly processes. Also, lower throughput coupled with higher processing costs was example of challenges in the TCB technology.

The leading enterprises in the TCB Bonder market are ASMPT (AMICRA) (HK) and K&S (US), which followed by Besi (NL), Shibaura (JP), SET (FR), and Hanmi (KR). These Top companies currently account for more than 91.03% of the total market share and are expected to retain their dominating hold over the market during the forecast period.

North America TCB Bonder market would keep being the largest market, followed by Europe in 2018. Japan market and China market would rank forth (12 units) and fifth (11 units).

The global TCB Bonder market is valued at 33 million US$ in 2017 and will reach 140 million US$ by the end of 2025, growing at a CAGR of 20.0% during 2018-2025.

Request Sample Copy of the Report @ https://www.qyresearch.com/sample-form/form/383563/global-tcb-bonder-market

The major manufacturers covered in this report

ASMPT (Amicra)

K&S

BESI

Shibaura

SET

Hamni

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering

North America

Europe

China

Japan

Southeast Asia

India

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

Automatic TCB Bonder

Manual TCB Bonder

On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including

IDMs

OSAT

Click to view the full report TOC, figure and tables: https://www.qyresearch.com/index/detail/383563/global-tcb-bonder-market

QY Research established in 2007, focus on custom research, management consulting, IPO consulting, industry chain research, data base and seminar services. The company owned a large basic data base (such as National Bureau of statistics database, Customs import and export database, Industry Association Database etc), expert’s resources (included energy automotive chemical medical ICT consumer goods etc.

QY Research, INC.
17890 Castleton,
Suite 218,
City of industry, CA - 91748
USA: +1 626 295 2442
Email – inquiry@qyrsearch.com
Web – www.qyresearch.com

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