Die Bonder Equipment Market New Research Report – Know About Opportunities Faced by Top Companies

Market research analysts at Publisher predict that the global die bonder equipment market will grow steadily during the next four years and post a CAGR of above 2% by 2021. This market research analysis identifies the increasing demand for semiconductor ICs as one of the primary factors for market growth. The rise in sales of both mobile and consumer electronic devices fuels the growth of the semiconductor market. Additionally, the emerging technologies such as Internet of Things (IoT), M2M, UHD TVs, hybrid laptops, and vehicle automation further propels the demand for semiconductor ICs. This, in turn, will increase the requirement for packaging and assembly equipment, fueling market growth.

For more information about this report: http://www.reportsweb.com/global-die-bonder-equipment-market-2017-2021 .

Covered in this report
The report covers the present scenario and the growth prospects of the global die bonder equipment market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

Publisher's report, Global Die Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- ASM Pacific Technology (ASMPT)
- Kulicke & Soffa
- Palomar Technologies

Request Sample Copy at http://www.reportsweb.com/inquiry&RW0001713457/sample .

Other prominent vendors
- Besi
- DIAS Automation
- Hesse
- Hybond
- SHINKAWA
- Toray Engineering
- West-Bond

Market driver
- Demand for high-quality semiconductor ICs for wireless devices and IoT applications.
- For a full, detailed list, view our report

Market challenge
- High demand for polymer adhesive wafer bonding equipment.
- For a full, detailed list, view our report

Market trend
- Increase in M&A in the semiconductor packaging and assembly market.
- For a full, detailed list, view our report
Inquire for Report at http://www.reportsweb.com/inquiry&RW0001713457/buying .

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This release was published on openPR.