Demand of Extended Ultraviolet Lithography Market Key Players, Applications, Recent Developments, and Market Analysis over Distributed Regions - Forecast to 2025

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With the advancement of the semiconductor equipment industry there has been a tremendous increase in demand for more cost effective and efficient production of electronic components with the increasing demand. The demand for electronics emerges from number of applications ranging from communication to consumer electronic devices to even sensor devices. In this respect, the demand for lithography systems increased considerably. Extended ultraviolet lithography is a progressive technology used for manufacturing of microprocessors and integrated circuits with wavelength of 13.5 nm. Extended ultraviolet lithography works when high flaming energetic beams of ultraviolet lights gets reflected from a circuit design pattern into a silicon wafer.

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Extended ultraviolet light has different properties at different wavelengths and this light should get reflected from mirrors instead of refracting through lenses onto the wafer. Currently, extended ultraviolet lithography consists of two condenser multilayer mirrors, six multilayer projection mirrors and a multilayer object. A European stepper manufacture uses an extended ultraviolet lithography having wavelength of upto 13.4 nm by using 0.25 numerical aperture camera without using OPC. For typical industrial applications of extended ultraviolet lithography it requires high power ultraviolet light source at a wavelength of 13.5 nm and a throughput of 100 wafers per hour.

The major driver boosting the extended ultraviolet lithography market is the increased for devices with comparatively low wavelengths, and a hundreds of times more powerful than those being used currently. The smaller wavelength results in highly dense packed components on the chips to generate fast processing power. The device speed increases with smaller gate lengths. Another driver that drives the extended ultraviolet market is the size of the device and the low cost. The major challenge in extended ultraviolet lithography is the placing of mirrors so perfectly that the light with acceptable precision.

The other major challenge that restricts the growth of the extended ultraviolet lithography is the complex technology used by extended ultraviolet lithography requires scanning systems for production of semiconductors, mask infrastructure and new chemicals. However, the semiconductor industry has a first choice of preference for an extended ultraviolet lithography due to its feel of traditional optical lithography and the use of same basic design tools. The extended ultraviolet lithography has the potential to design future chips to achieve 1000 times memory storage capacity and around 100 times faster than today’s available chips. Extended ultraviolet lithography is capable to change significantly, the microchip manufacturing industry, creating more efficient and precise process.

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Extended ultraviolet lithography market is segmented into light source, equipment, application and geography. Extended ultraviolet lithography market based on light source can be segmented into laser produced plasma, vacuum sparks, and gas discharges. Based on equipment, the extended ultraviolet lithography is segmented into light source, mirrors, mask and others. Further segmentation by application is further bifurcated into memory, IDM, foundry, and others. Extended ultraviolet lithography market is also segmented on the basis of regions into North America, South America, Europe, Asia Pacific, and Middle East & Africa.

One of the major players in global extended ultraviolet lithography market is ASML Holding. As of now there is only one manufacturer for extended ultraviolet lithography i.e. ASML. However, many other companies such as Intel, Cannon, and Nikon are investing in the extended ultraviolet lithography market. During the years 2018 to 2020, companies such as Samsung, TSMC, Micron are expected to be some major participants for the extended ultraviolet lithography market.

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