New Report from CIR Sees $3.5 Billion Market Opportunity in 2015 for Optical Interconnects Market
|Pressemitteilung von: CIR|
|(openPR) - Glen Allen, Virginia: CIR, an industry analyst firm based here, has just issued a new report that examines the market potential for optical interconnects. The report titled, New Revenue Opportunities for Optical Interconnects: A Market and Technology Forecast predicts that revenues from optical interconnect products will exceed $3.5 billion ($US) revenues by the year 2015.
Additional details are available at the CIR website at www.cir-inc.com/products/prod_detail.cfm?prod=1&id=236.
Insights from the report:
While copper has had a stranglehold on both computing and networking equipment applications, moving forward, CIR believes that it will be unable to re-invent itself quickly enough to support all of the advances listed above. With each new generation of copper interconnects comes the need for more sophisticated digital signal processing, which becomes more costly in several ways—dollars, power consumption and space. This is clearly not a direction in which either end users or OEMs want to move.
Optical integration is what CyOptics is doing in its Terapics project and Intel is trying with silicon photonics. However, optical integration still has a long way to go and there are many opportunities open with regard to chip design and materials used. CIR also sees considerable opportunity in the realm of quantum dot lasers. These are gradually becoming available and could enable chip-to-chip and on-chip optical interconnection. We could be on the cusp of transformation for board-to-board, chip-to-chip and on-chip with recent developments such as the Avago MicroPOD, Luxtera OptoPhy and Intel Light Peak as well as advances by QD Laser.
The volume opportunity for optical interconnects over the next five years will still be LC-to-LC jumpers in rack-based applications. There will also be healthy growth for MPO-to-LC and MPO-to-MPO assemblies.
About the Report:
This report is intended to provide in-depth analysis of optical interconnects markets and technologies. The specific purpose of this study focuses on likely new business opportunities for components including cable assemblies, chip-to-chip, on-board, cable and connectors and subsystems and modules firms utilizing or selling optical interconnects. In the report we discuss the markets for optical interconnects, which will include VSR telecom, servers and SANs (data centers) cabling, on-chip and chip-to-chip potential products. We also analyze how these developments in interconnection will impact the rest of the network. Also included is an analysis of the different types of possible new optical interconnect products like Light Peak from Intel and optical engines, that are now available from several suppliers, and how these products will affect the network. In addition, we cover optical integration and how its changing landscape will shape on-chip and chip-to-chip optical interconnects as well as novel laser types. Chapter Four includes forecasts for optical interconnect products by product type in volume and revenue terms.
CIR provides detailed market analysis and forecasting of the trends, technologies and opportunities in telecom and data communications components and modules markets. Since 1979 CIR has produced numerous reports that have tracked the cutting edge of the communications sector with a special focus on emerging technologies and high bandwidth networking.
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