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Press Release Archive
Alphabetical (index by companies).
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Press Releases from GOEPEL electronics Ltd.:
(99 total)
1.
GOEPEL electronics runs UK Technology Day in March 2012
2.
New Boundary Scan hardware from GOEPEL electronic compatible with MAC Panel SCOUT
3.
GOEPEL electronic opens Branch Office in India
4.
GOEPEL electronic integrates graphic Operation Panels for Control of Chip Embedded Instruments
5.
Cooperation enables extended Integration of Boundary Scan into Rohde & Schwarz TSVP Platform
6.
OptiCon System new inside and outside
7.
GOEPEL electronics extends ChipVORX Technology for FPGA Assisted Test & Measurement
8.
New Test System for Electro and Servo Motors
9.
New optical Inspection System for Combination Instrument Prototypes
10.
GOEPEL electronic ports VarioTAP Processor Emulation to Freescale Quorivva Micro Controller
11.
GOEPEL electronic extends Processor Emulation Test Support for Atmel Micro Controller
12.
GOEPEL electronic increases Engagement in Open Source Initiative goJTAG by new Demo Kit
13.
GOEPEL electronic accelerates LAN based High-Speed Programming of massive Flash Images
14.
GOEPEL electronic expands GATE Partner Program in Asia
15.
Elite Interfaces joins GOEPEL electronic’s GATE program
16.
GOEPEL electronic enlists chip-embedded instrumentation for high-speed RAM Access Test
17.
GÖPEL electronic demonstrates IJTAG (IEEE P1687) support in SYSTEM CASCON
18.
GOEPEL electronic enables graphical JTAG/Boundary-Scan Project Development
19.
New Digital I/O Module on PXI Basis for signal critical Desktop Applications
20.
Boundary Scan Platform SCANFLEX® extends Integration of Bus Interface Tests
21.
GOEPEL electronic provides new Test and Programming Strategies for Texas Instruments DaVinci Media Processors
22.
Open source Initiative provides free JTAG/Boundary Scan Software and a number of hardware Kits
23.
Made in Germany: Industry leading X-Ray and Optical Test Equipment now available in the US
24.
eXception integrates GOEPEL electronic’s Boundary Scan into Teradyne Test Station
25.
Safe inline X-Ray Inspection of double-sided equipped BGA Components
26.
GOEPEL electronic supports Picochip in testing next Generation ’Small cell’ Baseband chips
27.
Very easy: Revolutionary OCR for electronic Components
28.
GOEPEL electronic will exhibit leading Test Equipment at NEPCON Shenzhen 2011
29.
easyOCR™ Function enables Reading of Asian Characters
30.
Cost-efficient LIN Bus Communication on PXI Basis
31.
Intelligent Inspection System for selective Solder Joints features new Camera
32.
SoundChecker™ – New cost-efficient Acoustic Analysis System
33.
GOEPEL electronic provides new Test and Programming Strategies for Texas Instruments DaVinci Media Processors
34.
GOEPEL electronic and SPEA cooperate to integrate Boundary Scan into new Flying Prober Generation
35.
Half a dozen: GOEPEL electronic wins two “Best in Test Awards” 2011
36.
GOEPEL electronic combines Boundary Scan with real time Test of GBit LAN Interfaces
37.
First real Parallelisation of Boundary Scan and AOI improves Throughput and Test Execution
38.
New SCANFLEX® Gang Tester from GOEPEL electronic improves Efficiency during Boundary Scan Utilisation in the Mass Production
39.
GOEPEL electronic presents special Test Solutions at Automotive Testing Expo Europe
40.
GOEPEL electronic supports open source Initiative for increased Adoption of IEEE 1149.x/Boundary Scan
41.
PXI 6161 - new Communication Controller for MOST150
42.
Automated Inspection of Bonding Pads
43.
GOEPEL electronic will exhibit leading Test Equipment at NEPCON China 2011
44.
GOEPEL electronic extends Boundary Scan Platform SCANFLEX® by scalable multifunctional Controllers
45.
GOEPEL electronic combines Boundary Scan with analogue Opens/Shorts Tests
46.
Parallel ECU Test by powerful FlexRay Interface Module
47.
High-performance 3D Void Inspection with inline X-Ray System
48.
GOEPEL electronic provides new Test strategies for Altera NIOS™ Soft Processor
49.
GOEPEL electronics runs 9th UK Technology Day in 2011
50.
GOEPEL electronic extends support for Boundary Scan Applications throughout the entire Product Life Cycle
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