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Press Releases from congatec AG (22 total)

Happy new year for high-end embedded computers: The world's fastest Client Compu …

Deggendorf, Germany, 3 January 2023 * * * congatec - a leading vendor of embedded and edge computing technology - announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly. congatec expects series production of OEM designs based on these new modules to ramp up quickly and massively as the new processors with long life availability offer vast improvements in

Mini form factor for maximum performance

Deggendorf, Germany, 19. December 2022 * * * congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini. The new COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first half of 2023. Designed for small yet extremely performance-hungry applications the new COM-HPC Mini specification

Ultra-rugged quad core module

Deggendorf, Germany, 30 April 2020 * * * congatec - a leading vendor of embedded computing technology - introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen(TM) Embedded V1000 Series processors for the industrial temperature range from 40�C to +85�C. It is available with optional burn-in & cold-soak stress screening service for highest reliability. The most demanding graphics and compute workloads benefit from the

congatec reports strong growth with record revenues for the first half of 2018

congatec – a leading vendor of standardized and customized embedded computer boards and modules – today reports record revenues of $63.6M for the first half of 2018. Compared to 2017 1H, this represents a year over year increase of 31.6%, and marks the fifth consecutive quarter of record revenues. Additionally, based on the current order backlog, congatec expects FY2018 to achieve 20%+ growth over FY2017. The growth in 2018 results from

Focus on modular IoT standards

Deggendorf, Germany, 04 September 2018 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – announces its cooperation with the IoT Innovation Lab at the University of Applied Sciences (HAW) Landshut, which is supported by the Bavarian Center for Digitalization (Zentrum Digitalisierung.Bayern, ZD.B) and the State Ministry for Science and Art (StMWK). The purpose of the cooperation is to prepare

Powerful congatec six-pack for Type 6

Deggendorf, Germany, 3 April 2018 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – introduces its brand new conga-TS370 COM Express Type 6 Computer-on-Modules in parallel with the launch of the 8th Generation Embedded Intel Xeon and Intel Core processors (codename Coffee Lake H). They propel the 35-45 W TDP class of COM Express Type 6 modules to a

congatec launches COM Express Type 6 module with AMD Ryzen™ Embedded V1000 pro …

Deggendorf, Germany, 21 February, 2018 * * * congatec – a leading vendor of standardized and customized embedded computer boards and modules – introduces the conga-TR4 COM Express Type 6 module based on the new AMD Ryzen™ Embedded V1000 processors. Setting a new benchmark for high-end embedded computer modules, AMD Ryzen Embedded V1000 processors deliver up to 3X more GPU performance than competitive solutions, and up to 2X

congatec presents high-end Mini-ITX motherboard that scales across all processor …

Deggendorf, Germany, 30 January 2018 * * * congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – introduces the conga-IT6, a Mini-ITX embedded motherboard for high-end applications that offers high scalability across all suitable embedded processor sockets thanks to its COM Express Type 6 slot. Users of the new motherboard can scale their applications across all relevant

congatec partners with AMD for long-time support of AMD Geode™ processors

Deggendorf, Germany, 16 January 2018 * * * congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – and AMD have teamed together to provide extended life cycle support for one of the world's longest-serving x86 processors. The result is that AMD Geode™ processor boards from congatec will have planned availability until the end of 2021. “With the

congatec modules accelerate first-to-market strategies

Deggendorf, Germany, 22 November 2017 * * * congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – announces support of the new 64-bit NXP i.MX8 processors for the Qseven and SMARC module standards. As a member of NXP’s Early Access Program, the new congatec modules will be available in time with the production launch of the new

congatec brings German Industry 4.0 expertise to China

Deggendorf, Germany /Shanghai, China, November 2, 2017 * * * The Taiwan located subsidiary of congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – is presenting smart manufacturing IT platforms for ‘Made in China 2025’ (MIC 2025) solutions at CIIF, China International Industry Fair (Hall 6.1H, Booth A065) in Shanghai. These instantly deployable computing platforms enable Chinese machine building

congatec presents its roadmap to bring 10 GbE to the industrial fields

Deggendorf, Germany, September 6, 2017 * * *congatec – a leading technology company for embedded computer modules, single board computers, and embedded design and manufacturing services – announces its new extended roadmap for bringing 10 GbE interconnectivity to the industrial fields. Developed to enable embedded system engineers to design small form factor edge nodes with a low power envelope of less than 20 watts, congatec is breaking new ground to

congatec announces ComX standardization initiative

Deggendorf, Germany / Tokyo, Japan, 09 May, 2017 * * * congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – announces at the Embedded Systems Expo & Conference (ESEC 2017) in Japan (West Hall 1F , Booth W4-20) the extended standardization initiative ComX that goes beyond the current specifications for computer-on-modules. This ComX standardization targets two pillars, the API

congatec premiers Cloud API for IoT gateways and IoT edge servers

Deggendorf/Nuremberg, Germany, March 14, 2017 * * * congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – showcases a best practice design solution for the simplified orchestration of wireless sensor networks at Embedded World (hall 1, stand 358). It is based on the new, application ready congatec Cloud API (Application Programming Interface) for IoT Gateways that is capable of

congatec introduces highly flexible IoT gateway system

Deggendorf, Germany, August 16, 2016 * * * congatec, a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services, introduces its flexible IoT gateway solution. This new, highly flexible IoT gateway system is application ready and easily customizable for rapid field deployment. The congatec IoT gateway offers extreme levels of flexibility in terms of processing performance and software integration, able to host up

congatec strengthens its Japanese sales and support organization

Deggendorf, Germany / Tokyo, Japan, August 04, 2016 * * * congatec – a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services – appoints Yasuyuki Tanaka as Country Manager and Sales Director for Japan. Tanaka is a key player of congatec’s global sales team and will be directly supported by congatec’s Vice President Worldwide Sales, Fred Barden. Barden was hired

congatec fully supports SMARC 2.0 specification

Deggendorf, 30 June 2016 * * * congatec – a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services – has announced its full support of the new SMARC 2.0 specification, which was released by the Standardization Group for Embedded Technologies e.V. (SGET) just a few days ago. This major technology adaption extends congatec’s leading and extensive Computer-on-Module portfolio

congatec’s new COM Express modules with latest Intel Celeron processors, coden …

Deggendorf, Germany, 19 May 2016 * * * congatec, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design & manufacturing (EDM) services, increases the scalability of its COM Express Computer-on-Modules with two new entry-level models based on the latest Intel 14nm microarchitecture (formerly codename Skylake). The Intel Celeron processor-based COM Express Basic and Compact modules combine cost efficient dual-core CPU performance

Cooperation of congatec and PLG - PLG AG is a new Solution Partner for congatec …

As a result of the newly founded development cooperation with the congatec AG, PLG AG will offer customer specific solutions based on congatec Embedded Computer Modules effective immediately. This provides the customer with the ideal combination of the PLG's life cycle management and congatec's flexible XTX module concept. With PLG AG, congatec has found a partner with extensive experience as OEM manufacturer. PLG provides development, production, logistics and after-sales support in

First COM Express Compact computer module

congatec AG announces the conga-CLX, the first embedded computer module utilizing the miniaturized COM Express Compact standard Deggendorf, November 28, 2005 – congatec AG presents the conga-CLX, the first COM (Computer on Module) based on the COM Express Compact form factor. The compact size of just 95x95mm provides the ability to easily integrate this module. The conga-CLX is the first COM Express module offered by congatec. It\'s equipped with the low power

Computer-On-Modules enter a new performance class

conga-X945: the first XTX module with dual core technology Deggendorf/Nürnberg, February 14, 2006 – congatec AG exhibits the first XTX Module with an Intel™ Core® Duo processor at the Embedded World trade show. conga-X945 can compute at nearly twice the speed of ETX and XTX modules that are currently available. The ETX® compatible conga-X945 replaces the aging ISA bus with fast serial interfaces such as PCI Express and Serial ATA, which

Advantech, Ampro and congatec Announce New XTX Alliance

Taipei, Taiwan, June 7, 2006 – Advantech, Ampro and congatec, three leading embedded platform providers, announced today a new alliance to help promote the XTX standard for computer on modules. The goal is to provide existing ETX users with a logical and cost effective upgrade path that avoids large-scale carrier board redesign and provides access to the newest serial technologies such as PCI-Express, SATA and LPC. All embedded industrial platform

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