Press Releases from Shenzhen NORCO Intelligent Technology CO.,Ltd (3 total)
Full Featured Fanless System BIS-6590 Utilizing Next Gen NORCO’s Proprietary L …
NORCO currently announced to launch the embedded system BIS-6590 utilizing its next generation proprietary "ICEFIN" thermal design, ensures maximum heat dissipation and a true fanless system. This fanless embedded system is integrated into a 280mm× 219.2mm×115 mm chassis. The embedded motherboard BPC-7937 is based on Intel H61/Q77/B75 chipsets, supporting Intel Sandy Bridge/Ivy Bridge Core i3/i5 and Celeron processors. System provides redundant network connectivity with 3G support, one Mini PCIe, 2x…
NORCO Newly Released High Performance Fanless Embedded Box PC BIS-6660
NORCO, an associate member of Intel® Embedded Alliance, now releases a high performance fanless embedded box PC BIS-6660. It is a fanless embedded system with the new generation of NORCO's proprietary ICEFIN™ Thermal design, which ensures maximum heat dissipation and a true fanless system, and utilizes Intel latest Atom cedar trail N2800/D2550 embedded CPUs. System provides redundant network connectivity with Wifi and 3G support. One internal SIM slot offers system…
New Arrival: Fanless Intel 3rd Gen Quad Core i7 Ivy Bridge Dual NIC System BIS-6 …
The BIS-6922 is a passive cooling small form factor PC utilizing Intel’s 3rd generation Ivy Bridge processors including the Quad Core i7 mobile and embedded CPUs. Using Intel’s integrated HD Graphic 4000 with DirectX 11 capable and Intel Quick Sync Video hardware video encoding and decoding support, this system would be a great fit for any processor-intensive and media-intensive applications. The fanless BIS-6922 supports Core i5 and i7 processors with…
