| 03-18-2008 04:24 PM CET - Industry, Real Estate & Construction |
|
Particle free Laser Trimming of Micro Mirror Devices
Press release from: 3D-Micromac AG
(openPR) - MEMS fabrication technologies cause tolerances in device dimensions and consequently on key parameters like the resonant frequency. In contrast to these manufacturing tolerances industrial applications require defined conditions.
Therefore 3D-Micromac AG has developed an industrial-applicable laser-trimming tool to overcome these tolerances. The processing of Silicon in particular Micro Mirror Devices (MMD) by ultra-short pulse is accom-panied by a very small heat affected zone and causes a minimum of stress into the material. The trimming of all MMDs on a wafer to a certain frequency value is performed by selective ablation of material. The reported technology promises an increasing yield and maximizes the efficiency in MEMS production because a post fabrication tuning of the resonant frequency by software is no longer necessary.
The main goal is to trim all mirror elements on a wafer. Additional trimming elements at frequency influencing mirror components enable a trimming of mirrors to a certain frequency value. The laser cutting of trimming elements at the torsion spring effects a frequency decrease because of lowering beam stiffness while the removal of mass trimming elements at the mirror plate increases frequency by mass reduction. The contami-nation with particles is reduced by processing in fine vacuum and bonding and reflecting areas of the MMD remain clean.
The new laser-tool, which has been developed in collaboration with the Center for Microtechnologies of Technical University of Chemnitz, enables the measurement and trimming of MMDs on a wafer and simpli-fies the industrial use.
Femtosecond laser sources suit the application as well as picosecond laser sources but a picosecond laser workstation is the first choice because of its higher repetition rate for the development of a suitable system for industrial use.
The laser trimming technique is not limited to Silicon Micro Mirror Devices. It also fits all kinds of sensors and actuators and suits a large variety of materials, for instance ceramics.
Frequency trimming of MEMS devices is a promising approach to overcome these manufacturing tolerances, to tune sensors and actuators for certain operating conditions and it promises an increasing yield in MEMS technology.
Further information and pictures:
3D-Micromac AG
Dipl.-Betriebswirt (BA) Mandy Möckel
Marketing/ Sales
Annaberger Str. 240
D-09125 Chemnitz
GERMANY
Phone: +49 (0)371 400 43-0
Fax: +49 (0)371 400 43-40
E-Mail: info@3d-micromac.com
Web: www.3d-micromac.com
About 3D-Micromac AG
3D-Micromac AG, a leading supplier of customized laser micro machining systems, has gained an estab-lished position in the international market over the past several years.
As a developer and manufacturer of complex workstations, as a service provider for materials and surface machining or as a solution provider for the development of specific production processes - we are able to find the best solution for every customer’s task.
More: www.3d-micromac.com
Therefore 3D-Micromac AG has developed an industrial-applicable laser-trimming tool to overcome these tolerances. The processing of Silicon in particular Micro Mirror Devices (MMD) by ultra-short pulse is accom-panied by a very small heat affected zone and causes a minimum of stress into the material. The trimming of all MMDs on a wafer to a certain frequency value is performed by selective ablation of material. The reported technology promises an increasing yield and maximizes the efficiency in MEMS production because a post fabrication tuning of the resonant frequency by software is no longer necessary.
The main goal is to trim all mirror elements on a wafer. Additional trimming elements at frequency influencing mirror components enable a trimming of mirrors to a certain frequency value. The laser cutting of trimming elements at the torsion spring effects a frequency decrease because of lowering beam stiffness while the removal of mass trimming elements at the mirror plate increases frequency by mass reduction. The contami-nation with particles is reduced by processing in fine vacuum and bonding and reflecting areas of the MMD remain clean.
The new laser-tool, which has been developed in collaboration with the Center for Microtechnologies of Technical University of Chemnitz, enables the measurement and trimming of MMDs on a wafer and simpli-fies the industrial use.
Femtosecond laser sources suit the application as well as picosecond laser sources but a picosecond laser workstation is the first choice because of its higher repetition rate for the development of a suitable system for industrial use.
The laser trimming technique is not limited to Silicon Micro Mirror Devices. It also fits all kinds of sensors and actuators and suits a large variety of materials, for instance ceramics.
Frequency trimming of MEMS devices is a promising approach to overcome these manufacturing tolerances, to tune sensors and actuators for certain operating conditions and it promises an increasing yield in MEMS technology.
Further information and pictures:
3D-Micromac AG
Dipl.-Betriebswirt (BA) Mandy Möckel
Marketing/ Sales
Annaberger Str. 240
D-09125 Chemnitz
GERMANY
Phone: +49 (0)371 400 43-0
Fax: +49 (0)371 400 43-40
E-Mail: info@3d-micromac.com
Web: www.3d-micromac.com
About 3D-Micromac AG
3D-Micromac AG, a leading supplier of customized laser micro machining systems, has gained an estab-lished position in the international market over the past several years.
As a developer and manufacturer of complex workstations, as a service provider for materials and surface machining or as a solution provider for the development of specific production processes - we are able to find the best solution for every customer’s task.
More: www.3d-micromac.com
News-ID: 39922
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