Worldwide 3D Semiconductor Packaging Market Size Is Estimated to Reach $8.9 Billion by 2022 and Growing at a CAGR of 15.7 % from 2016 to 2022

Research Beam added report on “Global 3D Semiconductor Packaging Market Technology, Trends, Growth and Research – 3D Semiconductor Packaging Market by Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded, and Others), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material, and Others), and Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others) - Global Opportunity Analysis and Industry Forecast, 2014-2022”

Research Beam study says Global 3D semiconductor packaging market size is estimated to reach $8.9 billion by 2022, growing at a CAGR of 15.7 % from 2016 to 2022, Request Sample Copy @ http://www.researchbeam.com/3D-semiconductor-packaging-market/request-sample
The 3D semiconductor packaging market trends which navigate unprecedented growth in 3D semiconductor packaging industry include, its advantages over other packaging technologies, lower cost, smaller size and enhanced efficiency. In 3D Through Silicon via (TSV) technology, the vertical connections are made through silicon die, and interconnect length is reduced drastically as compared to 2D technology where the connections are horizontal. The technological advantages of 3D packaging drive its demand in high-end applications such as chips used in super computers, DRAMS, NAND, microelectronic circuits, and others. Owing to these advantages, 3D semiconductor packaging market size has a lot of potential to rise with high growth rate. In 2015, US had the highest 3D semiconductor packaging market share in the overall North America 3D semiconductor packaging market, due to the high penetration of 3D TSV technology.

Imminent requirement for size reduction in electronic devices, improved efficiency, and less power consumption drive the adoption of 3D semiconductor packaging in microelectronic devices and consequently navigates the growth in 3D semiconductor packaging industry. 3D semiconductor packaging technology provides improved performance of electrical devices operating at high frequencies, which increases its adoption in dynamic random access memory (DRAMS), NAND, and other high-end applications. It exhibits high speed and enhanced overall system efficiency while consuming smaller space as compared to its alternatives.

3D semiconductor packaging refers to an advanced packaging technology of semiconductor chips in which two or more layers of active electronic components are stacked together and interconnected vertically as well as horizontally to perform as a single device. This technology possesses various advantages over other advanced packaging technologies such as reduced space consumption, decreased power loss, better overall performance, and enhanced efficiency which makes 3D semiconductor packaging industry the leading amongst all advanced packaging technologies.

The demand for 3D packaged chips is expected to surge due to heavy investments on the R&D by many key players, including Amkor Technology, ASE group, Siliconware Precision Industries Co., Ltd., and others, leading to the improvement in advanced packaging technique. Leading outsourced assembly and test (OSAT) companies collaborate to give a tough competition to foundries in packaging business, thus fostering the market growth. For instance, in 2015, Jiangsu Changjiang Electronics Technology Co., Ltd. acquired Statschippac to increase its R&D capacity, and another giant ASE group is considering to acquire SPIL.

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POTENTIAL BENEFITS FOR STAKEHOLDERS:
• This report provides an in-depth analysis of the global 3D semiconductor packaging market along with current 3D semiconductor packaging market trends and future estimations to identify lucrative investment opportunities
• This report identifies the key drivers, opportunities, and restraints that shape the market along with their impact analysis
• Porter’s Five Forces analysis highlights the potency of buyers and suppliers that participate in this market to facilitate better business decisions for stakeholders and strengthen their supplier and buyer networks
• Market estimation of geographical regions is based on the current market scenario and future trends

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