AKCP Announces release of SP2+

The world's best-selling environmental and power monitoring platform has been upgraded. Three years in the making the SP2 has a new big brother the SP2+.

The SP2+ is a complete redesign of the SP2. With all new hardware and software, we combine the low cost, simplicity of use of the SP2, along with many of the high-end features of our popular securityProbe platform. These include Encrypted Email, SNMPv3, VPN and an internal cellular modem option.

Compatible with the latest range of AKCP Smart Sensors, SP2+ can connect to the recently introduced Thermal Map Sensor. Thermal Map Sensors combine 4 sensors into one sensor port on the SP2+. Specially designed to monitor the air entering and leaving a computer rack, the Thermal Map Sensor allows you to detect, in real time, hot spots in your data center. Monitor up to 4 rack air inlets or outlets from a single SP2+.

Several configurations of the SP2+ are available. An expansion port option gives compatibility with AKCP expansion units such as the E-Sensor 8 and the E-Opto 16, meaning additional sensor ports and dry contact can be added to give enhanced capabilities. A 12VDC version gives SP2+ the ability to interface to third party access control equipment such as electromagnetic locks, Weigand card readers and biometric sensors.

For a complete list of the features of the SP2+ you may visit our website on www.akcp.com to learn more about the sensorProbe+ product range.

AKCP established in 1981, created the market for networked temperature, environmental and power monitoring solutions. Today with over 100 employees and 120,000 installations, AKCP is the world’s oldest and largest manufacturer of SNMP enabled networked sensors.

For more information regarding the SP2+ release please contact:

Kevin Rivers
sales@akcp.com
www.akcp.com

Nicholas Barrowclough
nicholas.barrowclough@akcp.com
121/39, 9th Floor, RS Tower Building,
Ratchadaphisek Road,
Din Daeng, Bangkok, Thailand 10400
Phone: +66-2-642-3902
Fax: +66-2-642-3903
http://www.akcp.com/

This release was published on openPR.