(openPR) - (Taipei, Taiwan – February 10th, 2010) Lanner Electronics, a premier manufacturer of fanless embedded computers, today announced the new LEC-7020, an Intel Atom based industrial computer with 3G, GPS and WiFi capabilities. This small form factor computer has a VGA, COM, DIO, 4 USB ports, and an optional LVDS output. The LEC-7020 also boasts a new simplified design allowing quick component installation.

With an onboard SIM card socket and the mini PCIe attached to a 3G/GPS minicard module, the LEC-7020 can send GPS signals and communicate via a 3G modem. Internet is enabled through 2 GbE ports and optional WiFi module.

To drive digital content the LEC-7020 has an integrated Intel GMA 950 graphics engine and features a VGA port and an optional LVDS port. The addition of a LVDS port allows for direct computer to panel connection and reduces deployment costs for system integrators.

The LEC-7020 is elegantly designed for rapid hardware installation. The 4 screws at the bottom of the chassis double as base pads. After removing the 2 side screws and the base pads, the platform opens on a hinge, allowing easy access to the motherboard.

Built around the 1.6GHz Intel Atom N270 and 945GSE chipset, the LEC-7020 boasts reasonable performance for mainstream digital signage applications. Internally this machine holds a 2.5” SATA HDD, and a CompactFlash Socket and supports Windows XP 32-bit, XPe, and Linux kernel 2.6.16 and above. The system supports up to 2GB of memory through a single SODIMM socket.

The LEC-7020 is a SFF computer that measures only 42 mm in height. Despite its small size, the LEC-7020 offers 4 USB 2.0 ports, a serial port, a DIO port and audio in/out jacks.

For ordering information please visit our website at: www.lannerinc.com/wireless/LEC-7020

Or contact our sales department at sales@lannerinc.com.

About Lanner
Founded in 1986 and publicly listed (TAIEX 6245) since 2003, Lanner Electronics, Inc. is an ISO 9001 certified designer and manufacturer of network application platforms, network video platforms and applied computing hardware for first-tier companies. Lanner's expertise also extends to include driver and firmware support, enabling customers to optimize hardware and software communication to achieve faster time to market. With headquarters in Taipei, Taiwan and branches in the U.S. and China, Lanner is uniquely positioned to deliver custom technical solutions with localized, value-added service. Lanner is an Associate Member of the Intel® Embedded and Communications Alliance, a group of companies committed to developing modular, standards-based solutions based on technologies, processors, products, and services from Intel®.

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