Press release
Flip Chip 2018 Global Market Key Players – Advanced Semiconductor Engineering, Amkor Technology, Intel – Analysis and Forecast to 2022
Flip Chip Market
About Flip Chip
Flip chip is a type of packaging type, which interconnects chip and package carriers or substrates using a conductive bump. Conductive bumps are placed on the die surface, which is flipped to connect the substrate directly.
Technavio’s analysts forecast the Global Flip Chip Market Market to grow at a CAGR of 6.22% during the period 2018-2022.
Covered in this report
The report covers the present scenario and the growth prospects of the flip chip market. To calculate the market size, the report considers the revenue generated from the sales of flip chip.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, report name 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Advanced Semiconductor Engineering
• Amkor Technology
• Intel
• Samsung Electronics
• Taiwan Semiconductor Manufacturing Company
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Market driver
• Rise in demand for high functionality devices
Market challenge
• Rapid developments in other packaging technologies
Market trend
• Decreasing size of smartphones and portable devices
Key questions answered in this report
• What will the market size be in 2022 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Complete Report Details @ https://www.wiseguyreports.com/reports/3195831-global-flip-chip-market-2018-2022
Table Of Contents:
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 05: MARKET SIZING
• Market definition
• Market sizing 2017
• Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 07: MARKET SEGMENTATION BY TECHNOLOGY
• Overview
• Comparison by technology
• FCBGA
• FCCSP
PART 08: CUSTOMER LANDSCAPE
PART 09: MARKET SEGMENTATION BY END-USER
• Overview
• Comparison by end-user
• Electronics – Market size and forecast 2017-2022
• Heavy machinery and equipment – Market size and forecast 2017-2022
• IT and telecommunication – Market size and forecast 2017-2022
• Automotive – Market size and forecast 2017-2022
• Others – Market size and forecast 2017-2022
• Market opportunity by end-user
PART 10: REGIONAL LANDSCAPE
• Geographical segmentation
• Regional comparison
• APAC – Market size and forecast 2017-2022
• Americas – Market size and forecast 2017-2022
• EMEA – Market size and forecast 2017-2022
• Key leading countries
• Market opportunity
PART 11: DECISION FRAMEWORK
PART 12: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 13: MARKET TRENDS
• High adoption of copper pillars and micro bumps
• Decreasing size of smartphones and portable devices
• Increasing use of semiconductors in automobiles
• Increasing M&A among semiconductor vendors
PART 14: VENDOR LANDSCAPE
• Overview
• Landscape disruption
• Vendor Landscape
PART 15: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Advanced Semiconductor Engineering
• Amkor Technology
• Intel
• Samsung Electronics
• Taiwan Semiconductor Manufacturing Company
Continued…….
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